المؤلفون: Gagnard, X., Bonnaud, O.

المصدر: Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614) Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the. :147-151 2002

Relation: Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits

المؤلفون: Gagnard, X., Bonnaud, O.

المصدر: Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548) Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2001. IPFA 2001. Proceedings of the 2001 8th International Symposium on the. :156-160 2001

Relation: Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001

المؤلفون: Coudrain, P., Magnan, P., Batude, P., Gagnard, X., Leyris, C., Vinet, M., Castex, A., Lagahe-Blanchard, C., Pouydebasque, A., Cazaux, Y., Giffard, B., Ancey, P.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 56(11):2403-2413 Nov, 2009

المؤلفون: Henry, D., Cheramy, S., Charbonnier, J., Chausse, P., Neyret, M., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Gagnard, X., Saugier, E.

المصدر: 2009 IEEE International Conference on 3D System Integration 3D System Integration, 2009. 3DIC 2009. IEEE International Conference on. :1-7 Sep, 2009

Relation: 2009 IEEE International Conference on 3D System Integration (3DIC)

المؤلفون: Cheramy, S., Charbonnier, J., Henry, D., Astier, A., Chausse, P., Neyret, M., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Gagnard, X., Vittu, J.

المصدر: 2009 European Microelectronics and Packaging Conference Microelectronics and Packaging Conference, 2009. EMPC 2009. European. :1-6 Jun, 2009

Relation: 2009 European Microelectronics and Packaging Conference (EMPC)

المؤلفون: Pruvost, S., Cuchet, R., Pellissier, D., Telliez, I., Devulder, M., Gagnard, X., Ancey, P., Aid, M., Danneville, F., Dambrine, G., Rolland, N., Lepilliet, S.

المصدر: 2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium Radio Frequency Integrated Circuits (RFIC) Symposium, 2007 IEEE. :137-140 Jun, 2007

Relation: 2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium

المؤلفون: Orlando, B., Hida, R., Cuchet, R., Audoin, M., Viala, B., Pellissier, D., Gagnard, X., Ancey, P.

المصدر: INTERMAG 2006 - IEEE International Magnetics Conference Magnetics Conference, 2006. INTERMAG 2006. IEEE International. :60-60 May, 2006

Relation: 2006 IEEE International Magnetics Conference

المؤلفون: Carvou, E., Le Bihan, F., Salaün, A.C., Rogel, R., Bonnaud, O., Rey-Tauriac, Y., Gagnard, X., Roland, L.

المصدر: In Microelectronics Reliability 2002 42(9):1369-1372

المؤلفون: Gagnard, X., Rey-Tauriac, Y., Bonnaud, O.

المصدر: In Microelectronics Reliability 2001 41(9):1335-1340

المؤلفون: Gagnard, X., Taurin, M., Bonnaud, O.

المصدر: In Microelectronics Reliability 1999 39(6):759-763