المؤلفون: Putaala, J., Hagberg, J., Kangasvieri, T., Raumanni, J., Salmela, O., Rahko, M., Jaaskelainen, J., Galkin, T., Nousiainen, O., Jantunen, H.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 19(3):484-493 Sep, 2019

المؤلفون: Hagberg, J., Putaala, J., Raumanni, J., Salmela, O., Galkin, T.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(10):1634-1643 Oct, 2017

المؤلفون: Lasanen, M., Aubree, M., Cassan, C., Conte, A., David, J., Elayoubi, S-E., Galkin, T., Grigore, V., Le Masson, S., Lees, J., Louahlia-Gualous, H., Marquet, D., Mokhti, Z., Nuaymi, L., Scheck, H-O., Smalen, L.

المصدر: ICT 2013 Telecommunications (ICT), 2013 20th International Conference on. :1-5 May, 2013

Relation: 2013 20th International Conference on Telecommunications (ICT)

المؤلفون: Reid, M., Punch, J., Galkin, T., Vakevainen, K., Stenberg, T., Vilen, M., Pomeroy, M.J., Mihov, M.

المصدر: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :330-334 2005

Relation: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

المؤلفون: Punch, J., Grimes, R., Heaslip, G., Galkin, T., Vakevainen, K., Kyyhkynen, V., Elonen, E.

المصدر: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :398-405 2005

Relation: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

المؤلفون: Reid, M., Punch, J., Rodgers, B., Pomeroy, M.J., Galkin, T., Stenberg, T., Rusanen, O., Elonen, E., Vilen, M., Vakevainen, K.

المصدر: 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. Reliability physics Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International. :300-304 2005

Relation: 2005 IEEE International Reliability Physics Symposium. Proceedings 43rd Annual

المؤلفون: Griffin, P., Leahy, J.J., Punch, J., Galkin, T., Elonen, E., Rusanen, O.

المصدر: 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on. :242-250 2004

Relation: 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004.

المؤلفون: Grigorieva, M. A.^Aff1, Titov, M. A.^Aff1, Alekseev, A. A.^Aff1, Artamonov, A. A.^Aff2, Klimentov, A. A.^Aff3, Korchuganova, T. A.^Aff1, Milman, I. E.^Aff2, Galkin, T. P.^Aff2, Pilyugin, V. V.^Aff2

المصدر: Lobachevskii Journal of Mathematics. 40(11):1788-1798

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المؤلفون: Aleksandrov, A. A., Galkin, T. G., El'chaninov, M. M., Popova, O. V.

المصدر: Chemistry of Heterocyclic Compounds. August 2001 37(8):1040-1041