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1مؤتمر
المؤلفون: Sim, S. Y., Liu, Q., Kor, H. B., Gan, C. L.
المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023
Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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2مؤتمر
المؤلفون: Tay, J. Y., Cheah, J., Chef, S., Zeng, X. M., Liu, Q., Gan, C. L
المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-6 Jul, 2023
Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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3مؤتمر
المؤلفون: Chen, Y. Y., Liu, W. J., Zou, Y. S., Chung, M. H., Gan, C. L., Takiar, Hem
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :795-798 Dec, 2022
Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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4مؤتمر
المؤلفون: Zou, Y. S., Chung, M. H., Gan, C. L., Chen, Jeremy, Hsu, Claire, Takiar, Hem
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :567-569 Dec, 2022
Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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5مؤتمر
المؤلفون: Zou, Y. S., Chung, M. H., Gan, C. L., Hsu, Yun Ting, Takiar, Hem
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :419-422 Dec, 2021
Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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6مؤتمر
المؤلفون: Chen, C. M., Gan, C. L., Wilson, Kal, Tennant, Tracy, Du, Henry, Wong, Kok Wai, Ang, Xue Yong, Takiar, Hem
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :423-426 Dec, 2021
Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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7مؤتمر
المؤلفون: Zou, Y. S., Chung, M. H., Tennant, Tracy, Gan, C. L., Hsu, Yun Ting, Takiar, Hem
المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :286-290 Dec, 2020
Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
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8مؤتمر
المؤلفون: Chen, C. M., Gan, C. L., Zou, Y.S., Chung, M. H., Takiar, Hem
المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :49-52 Dec, 2020
Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
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9دورية أكاديمية
المؤلفون: Gan, C. L.Aff1, IDs10854023113894_cor1, Huang, Chen Yu, Zou, Yung Sheng, Chung, Min Hua, Takiar, Hem
المصدر: Journal of Materials Science: Materials in Electronics. 34(29)
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10مؤتمر
المؤلفون: Chua, C. T., Chef, S., Sanchez, K., Bascoul, G., Perdu, P., Tan, S. H., Gan, C. L.
المصدر: 2018 International Conference on Radiation Effects of Electronic Devices (ICREED) Radiation Effects of Electronic Devices (ICREED), 2018 International Conference on. :1-6 May, 2018
Relation: 2018 International Conference on Radiation Effects of Electronic Devices (ICREED)
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