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المؤلفون: Christopher Greene, Daryl Santos, Abid Alrahman Fawzi Abbas, Krishnaswami Srihari, Ganesh Pandiarajan, Satyanarayan Shivkumar Iyer
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1861-1867
مصطلحات موضوعية: 010302 applied physics, Materials science, Conformal coating, 02 engineering and technology, Temperature cycling, engineering.material, 021001 nanoscience & nanotechnology, 01 natural sciences, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Stress (mechanics), Printed circuit board, Coating, Soldering, Ball grid array, 0103 physical sciences, engineering, Electrical and Electronic Engineering, Composite material, 0210 nano-technology, Layer (electronics)
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المؤلفون: Pengcheng Yin, Ganesh Pandiarajan, Seungbae Park
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Computer science, visual_art, Electronic component, Process (computing), visual_art.visual_art_medium, Drop (telecommunication), Shipping container, Failure mode and effects analysis, Pad cratering, Drop test, Automotive engineering, Shock (mechanics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::aeb3b7bb93dbf52f69b4aeb829717820
https://doi.org/10.1109/ectc32696.2021.00337 -
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المؤلفون: Daryl Santos, Christopher Greene, Krishnaswami Srihari, Ganesh Pandiarajan, Abid-Alrahman Fawzi Abbas
المصدر: Procedia Manufacturing. 38:1138-1142
مصطلحات موضوعية: Materials science, Conformal coating, Temperature cycling, engineering.material, Industrial and Manufacturing Engineering, chemistry.chemical_compound, Printed circuit board, Coating, Parylene, chemistry, Artificial Intelligence, Ball grid array, Soldering, engineering, Composite material, Leakage (electronics)
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المؤلفون: Ross Havens, Krishnaswami Srihari, Ganesh Pandiarajan, Gurudutt Chennagiri, Satyanarayan Shivkumar Iyer
المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference.
مصطلحات موضوعية: Surface-mount technology, Engineering, Hardware_MEMORYSTRUCTURES, Reflow oven, business.industry, Bead probe technology, Mechanical engineering, Solder paste, Reflow soldering, Electronic engineering, Bumping, Wave soldering, business, Solder mask
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6a98418f4c3d08bd8a748fbe45dbc41e
https://doi.org/10.1109/ectc.2013.6575816