-
1مؤتمر
المؤلفون: Syshchyk, Olga, Cosnier, Thibault, Huang, Zheng-Hong, Cingu, Deepthi, Wellekens, Dirk, Vohra, Anurag, Geens, Karen, Vudumula, Pavan, Chatterjee, Urmimala, Decoutere, Stefaan, Wu, Tian-Li, Bakeroot, Benoit
المصدر: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2022 - IEEE 52nd European. :245-248 Sep, 2022
Relation: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC)
-
2مؤتمر
المؤلفون: Diehle, Patrick, Hubner, Susanne, Santi, Carlo De, Mukherjee, Kalparupa, Zanoni, Enrico, Meneghini, Matteo, Geens, Karen, You, Shuzhen, Decoutere, Stefaan, Altmann, Frank
المصدر: 2020 13th International Conference on Advanced Semiconductor Devices And Microsystems (ASDAM) Advanced Semiconductor Devices And Microsystems (ASDAM), 2020 13th International Conference on. :10-13 Oct, 2020
Relation: 2020 13th International Conference on Advanced Semiconductor Devices And Microsystems (ASDAM)
-
3دورية أكاديمية
المؤلفون: Gonçalez Filho, WalterAff1, Aff2, IDs41598023427471_cor1, Borga, Matteo, Geens, Karen, Cingu, Deepthi, Chatterjee, Urmimala, Banerjee, Sourish, Vohra, Anurag, Han, Han, Minj, Albert, Hahn, Herwig, Marx, Matthias, Fahle, Dirk, Bakeroot, BenoitAff1, Aff2, Decoutere, Stefaan
المصدر: Scientific Reports. 13(1)
-
4مؤتمر
المؤلفون: Magnani, Alessandro, Cosnier, Thibault, Amirifar, Nooshin, Zhao, Ming, Li, Xiangdong, Geens, Karen, Decoutere, Stefaan
المصدر: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-6 Jul, 2020
Relation: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
-
5مؤتمر
المؤلفون: Mukherjee, Kalparupa, De Santi, Carlo, Meneghesso, Gaudenzio, Zanoni, Enrico, Meneghini, Matteo, You, Shuzhen, Geens, Karen, Borga, Matteo, Bakeroot, Benoit, Decoutere, Stefaan
المصدر: 2020 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2020 IEEE International. :1-5 Apr, 2020
Relation: 2020 IEEE International Reliability Physics Symposium (IRPS)
-
6مؤتمر
المؤلفون: Geens, Karen, Li, Xiangdong, Zhao, Ming, Guo, Weiming, Wellekens, Dirk, Posthuma, Niels, Fahle, Dirk, Aktas, Ozgur, Odnoblyudov, Vlad, Decoutere, Stefaan
المصدر: 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Wide Bandgap Power Devices and Applications (WiPDA), 2019 IEEE 7th Workshop on. :292-296 Oct, 2019
Relation: 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)
-
7تقرير
المؤلفون: You, Shuzhen, Geens, Karen, Borga, Matteo, Liang, Hu, Hahn, Herwig, Fahle, Dirk, Heuken, Michael, Mukherjee, Kalparupa, De Santi, Carlo, Meneghini, Matteo, Zanoni, Enrico, Berg, Martin, Ramvall, Peter, Kumar, Ashutosh, Björk, Mikael T., Ohlsson, B. Jonas, Decoutere, Stefaan
مصطلحات موضوعية: Physics - Applied Physics
URL الوصول: http://arxiv.org/abs/2107.02469
-
8دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
9مؤتمر
المؤلفون: Stoffels, Steve, Oprins, Herman, Marcon, Denis, Geens, Karen, Kang, Xuanwu, Van Hove, Marleen, Decoutere, Stefaan
المصدر: 18th International Workshop on THERMal INvestigation of ICs and Systems Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on. :1-6 Sep, 2012
Relation: 2012 18th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
-
10مؤتمر
المؤلفون: Stoffels, Steve, Marcon, Denis, Geens, Karen, Kang, Xuanwu, Van Der Plas, Geert, Van Hove, Marleen, Decoutere, Stefaan
المصدر: 2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on. :1-5 Sep, 2011
Relation: 2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)