المؤلفون: Mondal, Saikat, Konstantinou, Xenofon, Geyik, Cemil S., Zhang, Zhichao, Aygun, Kemal

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2031-2036 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Geyik, Cemil S., Hill, Michael J., Zhang, Zhichao, Aygun, Kemal

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :898-902 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Geyik, Cemil S., Hill, Michael J., Zhang, Zhichao, Aygun, Kemal, Aberle, James T.

المصدر: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2022 IEEE Electrical Design of. :1-3 Dec, 2022

Relation: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

المؤلفون: Geyik, Cemil S., Zhang, Zhichao, Aygun, Kemal, Aberle, James T.

المصدر: 2021 22nd International Symposium on Quality Electronic Design (ISQED) Quality Electronic Design (ISQED), 2021 22nd International Symposium on. :160-163 Apr, 2021

Relation: 2021 22nd International Symposium on Quality Electronic Design (ISQED)

المؤلفون: Geyik, Cemil S., Hill, Michael J., Zhang, Zhichao, Aygun, Kemal, Aberle, James T.

المصدر: 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2020 IEEE 29th Conference on. :1-3 Oct, 2020

Relation: 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

المؤلفون: Sun, Jiwei, Qian, Zhiguo, Geyik, Cemil S., Aygun, Kemal

المصدر: 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2020 IEEE 29th Conference on. :1-3 Oct, 2020

Relation: 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

المؤلفون: Park, Jaehyun, Bhat, Ganapati, Geyik, Cemil S., Ogras, Umit Y., Lee, Hyung Gyu

المصدر: 2018 IEEE Biomedical Circuits and Systems Conference (BioCAS) Biomedical Circuits and Systems Conference (BioCAS), 2018 IEEE. :1-4 Oct, 2018

Relation: 2018 IEEE Biomedical Circuits and Systems Conference (BioCAS)

المؤلفون: Geyik, Cemil S., Zhang, Zhichao, Christ, Sean R., Wojewoda, Leigh E., Aygun, Kemal

المصدر: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018 IEEE 27th Conference on. :271-273 Oct, 2018

Relation: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

المؤلفون: Geyik, Cemil S., Dutta, Arindam, Ogras, Umit Y., Bliss, Daniel W.

المصدر: 2016 50th Asilomar Conference on Signals, Systems and Computers Signals, Systems and Computers, 2016 50th Asilomar Conference on. :846-850 Nov, 2016

Relation: 2016 50th Asilomar Conference on Signals, Systems and Computers

المؤلفون: Geyik, Cemil S., Zhang, Zhichao, Aygun, Kemal

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :985-991 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)