المؤلفون: Gielen, A.W.J., Valega Mackenzie, F.O.

المصدر: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on. :1-9 Apr, 2015

Relation: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Veninga, E.P., Kregting, R., van der Waal, A., Gielen, A.W.J.

المصدر: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-5 Apr, 2013

Relation: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: de Borst, E.C.M., Gielen, A.W.J., Etman, L.F.P.

المصدر: 2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-6 Sep, 2012

Relation: 2012 4th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Gielen, A.W.J., Hesen, P., Swartjes, F., van Zeijl, H., Boschman, F., Bullema, J-E., Werkhoven, R.J., Koh, S.

المصدر: 18th European Microelectronics & Packaging Conference Microelectronics and Packaging Conference (EMPC), 2011 18th European. :1-7 Sep, 2011

Relation: 2011 18th European Microelectronics and Packaging Conference (EMPC)

المؤلفون: Gielen, A.W.J., Barink, M., van den Brand, J., van Mol, A.M.B.

المصدر: EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on. :1-6 Apr, 2009

Relation: 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Farley, D.M., Boschman, F., Bullema, J.E., Gielen, A.W.J., Hesen, P., Krugers, J.P.H.M., Swartjes, F., van Zeijl, H., Zhang, G.Q.

المصدر: 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on. :1/3-3/3 Apr, 2012

Relation: 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Ye, H., Gielen, A.W.J., vanZeijl, H.W., Werkhoven, R.J., Zhang, G.Q.

المصدر: 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on. :1/6-6/6 Apr, 2011

Relation: 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Veninga, E.P., Gielen, A.W.J.

المصدر: 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on. :1-1 Apr, 2010

Relation: 2010 11th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Gielen, A.W.J., Valega Mackenzie, F.O.

المصدر: In Microelectronics Reliability July 2016 62:50-57

المؤلفون: Loup, D.C.^Aff2, Matteson, R.C.^Aff2, Gielen, A.W.J.^Aff3

المساهمون: Thomsen, O.T., editor^Aff1, Bozhevolnaya, E., editor^Aff1, Lyckegaard, A., editor^Aff1

المصدر: Sandwich Structures 7: Advancing with Sandwich Structures and Materials : Proceedings of the 7th International Conference on Sandwich Structures, Aalborg University, Aalborg, Denmark, 29–31 August 2005. :87-96