المؤلفون: Silomon, Jendrik, Gluch, Jurgen, Clausner, Andre, Zschech, Ehrenfried

المصدر: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021 IEEE International Symposium on the. :1-6 Sep, 2021

Relation: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Silomon, Jendrik, Gluch, Jurgen, Posseckardt, Juliane, Clausner, Andre, Paul, Jens, Breuer, Dirk, Zschech, Ehrenfried

المصدر: 2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021

Relation: 2021 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Silomon, Jendrik, Gluch, Jurgen, Clausner, Andre, Paul, Jens, Zschech, Ehrenfried

المصدر: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2020 IEEE International Symposium on the. :1-6 Jul, 2020

Relation: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Jager, Matthias, Lorenz, Martin, Muller, Robert, Kobelke, Jens, Wondraczek, Katrin, Valiente, Rafael, Diego-Rucabado, Andrea, Cano, Israel, Aguado, Fernando, Gluch, Jurgen, Kinski, Isabel, Dorosz, Dominik, Kochanowicz, Marcin

المصدر: 2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC) Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), 2021 Conference on. :1-1 Jun, 2021

Relation: 2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)

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المؤلفون: Yeap, Kong Boon, Gall, Martin, Sander, Christoph, Niese, Sven, Liao, Zhongquan, Ritz, Yvonne, Rosenkranz, Rudiger, Muhle, Uwe, Gluch, Jurgen, Zschech, Ehrenfried, Aubel, Oliver, Beyer, Armand, Hennesthal, Christian, Hauschildt, Meike, Talut, Georg, Poppe, Jens, Vogel, Norman, Engelmann, Hans-Jurgen, Stauffer, Douglas, Major, Ryan, Warren, Oden

المصدر: 2013 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2013 IEEE International. :2F.1.1-2F.1.5 Apr, 2013

Relation: 2013 IEEE International Reliability Physics Symposium (IRPS)

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المؤلفون: Topal, Emre, Gluch, Jurgen, Clausner, Andre, Cardoso, Andre, Zschech, Ehrenfried

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology; Mar2021, Vol. 11 Issue 3, p504-509, 6p

مصطلحات موضوعية: COMPUTED tomography, EPOXY compounds, YOUNG'S modulus, FILLER materials, FINITE element method, POSITRON emission

المؤلفون: Kutukova, Kristina, Liao, Zhongquan, Werner, Stephan, Guttmann, Peter, Standke, Yvonne, Gluch, Jurgen, Schneider, Gerd, Zschech, Ehrenfried

المصدر: Microscopy & Microanalysis; 2018 Supplement2, Vol. 24, p438-439, 2p

المؤلفون: Kubec, Adam, Niese, Sven, Gluch, Jurgen, Rosenthal, Martin, Todt, Juraj, Keckes, Jozef, Gawlitza, Peter

المصدر: Microscopy & Microanalysis; 2018 Supplement2, Vol. 24, p436-437, 2p