المؤلفون: Morvan, E., Gobil, Y., Morisot, F., Biscarat, J., Charles, M., Lugo, J., Divay, A., Medbouhi, M., Charlet, I., Delprato, J., Scheiblin, P., Rrustemi, B., Giry, A., Serhan, A., Ruel, S., Pimenta-Barros, P., Laulagnet, F., Minoret, S., Anotta, A., Billon, T., Duriez, B.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Chanuel, A., Gobil, Y., Hsu, C.L., Charles, M., Coig, M., Biscarrat, J., Aussenac, F., Defrance, N., Gaquiere, C., Gaillard, F., Morvan, E.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(10):5530-5535 Oct, 2022

المؤلفون: Kim, Donghyun, Theodorou, C., Chanuel, A., Gobil, Y., Charles, M., Morvan, E., Woo Lee, Jae, Mouis, M., Ghibaudo, G.

المصدر: In Solid State Electronics November 2022 197

المؤلفون: Achard, H., Ducroquet, F., Coudert, F., Previtali, B., Lugand, J.F., Ulmer, L., Farjot, T., Gobil, Y., Heitzmann, M., Tedesco, S., Nier, M.E., Deleonibus, S.

المصدر: 30th European Solid-State Device Research Conference Solid-State Device Research Conference, 2000. Proceeding of the 30th European. :408-411 2000

Relation: 30th European Solid-State Device Research Conference

المؤلفون: Arnaud, L., Tartavel, G., Berger, T., Mariolle, D., Gobil, Y., Touet, I.

المصدر: 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296) Reliability physics Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International. :263-269 1999

Relation: 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual

المؤلفون: Baud, L., Passemard, G., Gobil, Y., M'Saad, H., Corte, A., Pires, F., Fugler, P., Noel, P., Rabinzohn, P., Beinglass, I.

المصدر: European Workshop Materials for Advanced Metallization, Materials for advanced metallization Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop. :64-67 1997

Relation: European Workshop Materials for Advanced Metallization. MAM'97 Abstracts Booklet

المؤلفون: Assous, M., Morand, Y., Demolliens, O., Berruyer, P., Manierre, B., Gobil, Y., Louis, D., Feldis, H., Vizioz, C., Roman, A.

المصدر: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) Interconnect technology Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International. :90-92 2000

Relation: Proceedings of the IEEE 2000 International Interconnect Technology Conference

المؤلفون: Ducroquet, F., Achard, H., Coudert, F., Previtali, B., Lugand, J.-F., Ulmer, L., Farjot, T., Gobil, Y., Heitzmann, M., Tedesco, S., Nier, M.E., Deleonibus, S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 48(8):1816-1821 Aug, 2001

المؤلفون: Moussavi, M., Gobil, Y., Ulmer, L., Perroud, L., Motte, P., Torres, J., Romagna, F., Fayolle, M., Palleau, J., Plissonier, M.

المصدر: Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) Interconnect technology Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International. :295-297 1998

Relation: Proceedings of the IEEE 1998 International Interconnect Technology Conference

المؤلفون: Deleonibus, S., Heitzmann, M., Gobil, Y., Martin, F., Demolliens, O., Guillaumot, B., Candelier, P., Guibert, J.C.

المصدر: ESSDERC '96: Proceedings of the 26th European Solid State Device Research Conference Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European. :183-186 Sep, 1996

Relation: Proceedings of the 26th European Solid State Device Research Conference