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1مؤتمر
المصدر: 2024 1st International Conference on Innovative Sustainable Technologies for Energy, Mechatronics, and Smart Systems (ISTEMS) Innovative Sustainable Technologies for Energy, Mechatronics, and Smart Systems (ISTEMS), 2024 1st International Conference on. :1-6 Apr, 2024
Relation: 2024 1st International Conference on Innovative Sustainable Technologies for Energy, Mechatronics, and Smart Systems (ISTEMS)
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2مؤتمر
المؤلفون: Deutsch, Sergej, Chickermane, Vivek, Keller, Brion, Mukherjee, Subhasish, Konijnenburg, Mario, Marinissen, Erik Jan, Goel, Sandeep K.
المصدر: 2011 Asian Test Symposium Test Symposium (ATS), 2011 20th Asian. :395-400 Nov, 2011
Relation: 2011 IEEE 20th Asian Test Symposium (ATS)
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3
المؤلفون: Goel, Sandeep K., Adham, Saman, Wang, Min-Jer, Lee, Frank, Chickermane, Vivek, Keller, Brion L., Valind, Thomas, Marinissen, Erik Jan, Franzon, P.D., Marinissen, E.J., Bakir, M.S.
المساهمون: Electronic Systems
المصدر: Handbook of 3D integration: volume 4: design, test, and thermal management, 325-346
STARTPAGE=325;ENDPAGE=346;TITLE=Handbook of 3D integrationمصطلحات موضوعية: Interconnection, business.product_category, business.industry, Computer science, media_common.quotation_subject, Stacking, Process (computing), Three-dimensional integrated circuit, Debugging, Embedded system, Hardware_INTEGRATEDCIRCUITS, Die (manufacturing), business, Design paradigm, Dram, media_common
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::be4f477eabebb88e73dfb92ae478f44b
https://doi.org/10.1002/9783527697052.ch15 -
4
المؤلفون: Cron, Adam, Marinissen, Erik Jan, Goel, Sandeep K., McLaurin, Teresa, Bhatia, Sandeep, Franzon, P.D., Marinissen, E.J., Bakir, M.S.
المساهمون: Electronic Systems
المصدر: Handbook of 3D Integration
Handbook of 3D integration: volume 4: design, test, and thermal management, 301-323
STARTPAGE=301;ENDPAGE=323;TITLE=Handbook of 3D integrationمصطلحات موضوعية: Stack (abstract data type), Computer science, business.industry, Embedded system, Serial port, business, Parallel port, Die (integrated circuit), Test (assessment)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0877118209d1c69aa1411d0aa89a8f0b
https://doi.org/10.1002/9783527697052.ch14 -
5مؤتمر
المؤلفون: Vermeulen, Bart, Urfianto, Mohammad Z., Goel, Sandeep K.
المصدر: DAC: Annual ACM/IEEE Design Automation Conference; Jun2004, p514-517, 4p
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6دورية أكاديمية
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7كتاب
المساهمون: Goel, Sandeep K., editor., Chakrabarty, Krishnendu, editor.
مصطلحات موضوعية: Metal oxide semiconductors, Complementary -- Testing.
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8دورية أكاديمية
المؤلفون: Goel SK; Department of Skin and VD KMC, Mangalore-575 001, India., Kuruvila M
المصدر: Indian journal of dermatology, venereology and leprology [Indian J Dermatol Venereol Leprol] 2002 Sep-Oct; Vol. 68 (5), pp. 295.
نوع المنشور: Journal Article
بيانات الدورية: Publisher: Scientific Scholar on behalf of Indian Association of Dermatologists, Venereologists & Leprologists Country of Publication: United States NLM ID: 7701852 Publication Model: Print Cited Medium: Internet ISSN: 0973-3922 (Electronic) Linking ISSN: 03786323 NLM ISO Abbreviation: Indian J Dermatol Venereol Leprol Subsets: PubMed not MEDLINE