-
1مؤتمر
المؤلفون: Gong, Tingrui, Li, Lianghui, Shi, Maolin, Gao, Lei, Li, Juntao
المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022
Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
-
2مؤتمر
المؤلفون: Gao, Lei, Gong, Tingrui, Meng, Yinghao, Yan, Xinzhu, Li, Juntao
المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022
Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
-
3دورية أكاديمية
المؤلفون: Wu, Yongjia, Zhang, Peng, Chen, Sen, Zhi, Congcong, Shi, Tianhao, Gong, Tingrui, Ming, Tingzhen
المصدر: In Case Studies in Thermal Engineering June 2024 58
-
4دورية أكاديمية
المؤلفون: Gong, Tingrui, Hou, Gu, Wu, Yongjia, Li, Lianghui, Wang, Yuexing, Shi, Maolin, Kang, Lingfeng, Zhou, Jie, Cao, Linwei, Gao, Lei, Ming, Tingzhen, Li, Juntao, Su, Wei
المصدر: In Applied Thermal Engineering 1 May 2024 244
-
5دورية أكاديمية
المؤلفون: Gong, Tingrui, Li, Lianghui, Shi, Maolin, Hou, Gu, Kang, Lingfeng, Gao, Lei, Li, Juntao
المصدر: In Applied Thermal Engineering August 2023 231
-
6دورية أكاديمية
المؤلفون: Gong, Tingrui, Li, Lianghui, Shi, Maolin, Kang, Lingfeng, Gao, Lei, Li, Juntao
المصدر: In Applied Thermal Engineering April 2023 224
-
7دورية أكاديمية
المؤلفون: Wu, Yongjia, Chen, Sen, Gong, Tingrui, Shi, Tianhao, Zuo, Lei, Yan, Yonggao, Fang, Yueping, Ming, TingzhenAff1, IDs1163002216372_cor8
المصدر: Journal of Thermal Science. 31(4):1094-1105
-
8دورية أكاديمية
المؤلفون: Gong, TingruiAff1, Aff2, IDs116300221591z_cor1, Gao, LeiAff1, Aff2, Wu, Yongjia, Tan, HaoshuAff1, Aff2, Qin, FengAff1, Aff2, Xin, XiongAff1, Aff2, Shen, Limei, Li, JuntaoAff1, Aff2, Ming, Tingzhen
المصدر: Journal of Thermal Science. 31(3):712-726
-
9دورية أكاديمية
-
10دورية أكاديميةThermo-mechanical optimization of ceramic substrate with through ceramic vias by Taguchi-Grey method
المؤلفون: Gong, Tingrui, Qin, Feng, Yan, Xinzhu, Gao, Lei, Yang, Yingkun, Lei, Zhicheng, Tan, Haoshu, Li, Juntao
المصدر: In Microelectronics Reliability May 2022 132