يعرض 1 - 10 نتائج من 18 نتيجة بحث عن '"Gong, Weixi"', وقت الاستعلام: 1.05s تنقيح النتائج
  1. 1
    مؤتمر

    المصدر: 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS) Power Electronics and Application Symposium (PEAS), 2023 IEEE 2nd International. :2259-2264 Nov, 2023

    Relation: 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)

  2. 2
    مؤتمر

    المصدر: 2023 IEEE 6th International Electrical and Energy Conference (CIEEC) Electrical and Energy Conference (CIEEC), 2023 IEEE 6th International. :2076-2081 May, 2023

    Relation: 2023 IEEE 6th International Electrical and Energy Conference (CIEEC)

  3. 3
    مؤتمر

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

  4. 4
    دورية

    المصدر: IEEE Transactions on Power Electronics; October 2024, Vol. 39 Issue: 10 p13285-13299, 15p

  5. 5
    دورية أكاديمية
  6. 6
  7. 7
  8. 8
    مؤتمر

    المؤلفون: Gong, Weixi

    المصدر: ACM International Conference Proceeding Series; Sep2003, p505-509, 5p

  9. 9
    دورية أكاديمية
  10. 10
    دورية أكاديمية

    المؤلفون: Gou R, Li J, Qin H, Cai Q, Wang Q, Gong W

    المصدر: Lin chuang er bi yan hou tou jing wai ke za zhi = Journal of clinical otorhinolaryngology, head, and neck surgery [Lin Chuang Er Bi Yan Hou Tou Jing Wai Ke Za Zhi] 2013 Nov; Vol. 27 (22), pp. 1269-71.

    نوع المنشور: English Abstract; Journal Article; Research Support, Non-U.S. Gov't

    بيانات الدورية: Publisher: Lin chuang er bi yan hou tou jing wai ke za zhi bain ji bu Country of Publication: China NLM ID: 101303164 Publication Model: Print Cited Medium: Print ISSN: 2096-7993 (Print) Linking ISSN: 20967993 NLM ISO Abbreviation: Lin Chuang Er Bi Yan Hou Tou Jing Wai Ke Za Zhi Subsets: MEDLINE