المؤلفون: Gorecki, K., Ptak, P., Janicki, M.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(8):1130-1138 Aug, 2023

المؤلفون: Wieczerzak K., Bala P., Dziurka R., Stepien M., Tokarski T., Cios G., Gorecki K.

المصدر: Archives of Metallurgy and Materials, Vol 61, Iss 2, Pp 1241-1247 (2016)

مصطلحات موضوعية: Fe-Cr-Ni-Mo-C, in-situ composites, intermetallic compounds, dilatometry, microstructure, Mining engineering. Metallurgy, TN1-997, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://www.degruyter.com/view/j/amm.2016.61.issue-2/amm-2016-0205/amm-2016-0205.xml?format=INT; https://doaj.org/toc/2300-1909

URL الوصول: https://doaj.org/article/4e50df865dda4fcfa336897b68748ebf

المؤلفون: Gorecki, P., Gorecki, K., Kisiel, R., Brzozowski, E., Bar, J., Guziewicz, M.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(11):1988-1996 Nov, 2021

المؤلفون: Gorecki, K., Detka, K.

المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 70:1-10 2021

المؤلفون: Gorecki, K., Gorecki, P.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 35(12):13420-13428 Dec, 2020

المؤلفون: Torzewicz, T., Ptak, P., Samson, A., Raszkowski, T., Janicki, M., Gorecki, K.

المصدر: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019 18th IEEE Intersociety Conference on. :131-136 May, 2019

Relation: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Janicki, M., Ptak, P., Torzewicz, T., Gorecki, K.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 67(8):3186-3190 Aug, 2020

المؤلفون: Gorecki, K., Ptak, P.

المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 69(1):212-220 Jan, 2020

المؤلفون: Gorecki, K., Gorecki, P., Zarebski, J.

المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 68(12):4864-4875 Dec, 2019

المؤلفون: Dziurdzia, B., Gorecki, K., Ptak, P.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(11):2160-2167 Nov, 2019