يعرض 1 - 10 نتائج من 19 نتيجة بحث عن '"Gottfried, Knut"', وقت الاستعلام: 1.19s تنقيح النتائج
  1. 1
    مؤتمر
    Advancing Fine Pitch (< 5μm) Interconnects through Self-Aligned Die-to-Wafer Hybrid Bonding for Chiplet Integration

    المؤلفون: Dubey, Vikas, Wunsch, Dirk, Gottfried, Knut, Kinner, Robert, Suroshe, Rajat, Kuchler, Matthias, Stephan, Ronny, Schermer, Sebastian, Helke, Christian, Hasse, Micha, Reuter, Danny, Weimer, Maik, Schulz, Stefan

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :469-473 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  2. 2
    مؤتمر
    Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding

    المؤلفون: Dubey, Vikas, Wunsch, Dirk, Gottfried, Knut, Wiemer, Maik, Fischer, Tobias, Schermer, Sebastian, Dittmar, Nils, Helke, Christian, Haase, Micha, Ghosal, Sanghamitra, Hanisch, Anke, Bonitz, Jens, Luo-Hofmann, Jinji, Hofmann, Lutz, Lykova, Maria, Stoll, Fiete, Vogel, Klaus, Schulz, Stefan E.

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :795-799 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Automatic Detection of Via Arrays in AFM Images for CMP Dishing Evaluation

    المؤلفون: Zienert, Andreas, Langer, Jan, Hensel, Doreen, Hofmann, Lutz, Gottfried, Knut, Schuster, Jorg

    المصدر: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023

    Relation: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)

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  4. 4
    مؤتمر
    Towards knowledge-enhanced process models for semiconductor fabrication

    المؤلفون: Rothe, Tom, Sayyed, Mudassir Ali, Langer, Jan, Gottfried, Knut, Schuster, Jorg, Stoll, Martin, Kuhn, Harald

    المصدر: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023

    Relation: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)

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  5. 5
    مؤتمر
    The BDRIE-HS* Technology Approach for Tiny Motion Detection with Improved Sensitivity and Noise Performance

    المؤلفون: Forke, Roman, Hiller, Karla, Hahn, Susann, Shaporin, Alexey, Weidlich, Sebastian, Bulz, Daniel, Kuchler, Matthias, Reuter, Danny, Helke, Christian, Wunsch, Dirk, Gottfried, Knut, Kuhn, Harald

    المصدر: 2022 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL) Inertial Sensors and Systems (INERTIAL), 2022 IEEE International Symposium on. :1-4 May, 2022

    Relation: 2022 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)

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  6. 6
    مؤتمر
    Advanced Packaging Cost Reduction by Selective Copper Metallization

    المؤلفون: Mavliev, Rashid, Gottfried, Knut, Rhoades, Robert

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :327-332 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Selective Metal Deposition To Increase Productivity

    المؤلفون: Rhoades, Robert L., Mavliev, Rashid, Gottfried, Knut

    المصدر: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2020 31st Annual. :1-3 Aug, 2020

    Relation: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

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  8. 8
    مؤتمر
    SIMEIT-project: High precision inertial sensor integration on a modular 3D-Interposer platform

    المؤلفون: Steller, Wolfram, Meinecke, Christoph, Gottfried, Knut, Woldt, Gregor, Gunther, Wolfgang, Wolf, M. Juergen, Dieter Lang, K.

    المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :1218-1225 May, 2014

    Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Surface modification of porous low-k material by plasma treatment and its application on reducing the damage from sputtering and CMP process

    المؤلفون: Lu, Hai-Sheng, Gottfried, Knut, Ahner, Nicole, Schulz, Stefan, Qu, Xin-Ping

    المصدر: 2011 IEEE International Interconnect Technology Conference Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International. :1-3 May, 2011

    Relation: Joint 2011 IEEE International Interconnect Technology Conference (IITC) & 2011 Materials for Advanced Metallization (MAM)

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  10. 10
    دورية أكاديمية
    Investigation of CH4, NH3, H2 and He plasma treatment on porous low-k films and its effects on resisting moisture absorption and ions penetration

    المؤلفون: Lu, Hai-Sheng, Gottfried, Knut, Ahner, Nicole, Schulz, Stefan, Qu, Xin-Ping

    المصدر: In Microelectronic Engineering June 2013 106:85-90

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