يعرض 1 - 10 نتائج من 151,199 نتيجة بحث عن '"Grain size"', وقت الاستعلام: 1.06s تنقيح النتائج
  1. 1
    مؤتمر
    Multisensor Validation of Snow Albedo and Grain Size Retrieval in Mountain Areas

    المؤلفون: Notarnicola, C., Santos, B., Barella, R., Claus, M., Cremonese, E., De Gregorio, L., Di Mauro, B., Schwaizer, G., Nagler, T.

    المصدر: IGARSS 2024 - 2024 IEEE International Geoscience and Remote Sensing Symposium Geoscience and Remote Sensing Symposium, IGARSS 2024 - 2024 IEEE International. :619-622 Jul, 2024

    Relation: IGARSS 2024 - 2024 IEEE International Geoscience and Remote Sensing Symposium

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  2. 2
    مؤتمر
    Snow Grain Size Mapping Using Prisma Hyperspectral Data over the South Lhonak Glacier

    المؤلفون: Singh, Manmit Kumar, Bhawana, Bhawana, Bharti, Rishikesh

    المصدر: IGARSS 2024 - 2024 IEEE International Geoscience and Remote Sensing Symposium Geoscience and Remote Sensing Symposium, IGARSS 2024 - 2024 IEEE International. :3682-3685 Jul, 2024

    Relation: IGARSS 2024 - 2024 IEEE International Geoscience and Remote Sensing Symposium

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  3. 3
    مؤتمر
    A Study on Fabrication and Heat Dissipation of Polycrystalline Diamonds

    المؤلفون: Zhang, Dongliang, Gan, Zhiwen, Sun, Zhanpeng, Zhang, Yanyan, Sun, Xiang, Wang, Qijun, Wu, Gai, Shen, Wei, Gan, Zhiyin, Liu, Sheng

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-3 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  4. 4
    مؤتمر
    Effect of pH on Electrochemical, Morphological and Optical Properties of Electrodeposited Molybdenum Sulfide Thin Film

    المؤلفون: Rummaja, Iskandar Dzulkarnain, Idris, Muhammad Idzdihar, Ramlee, Radi Husin, Napiah, Zul Atfyi Mohammed, Rashid, Marziani, Aziz, Ahmad Muhajer Abdul

    المصدر: 2024 IEEE International Conference on Semiconductor Electronics (ICSE) Semiconductor Electronics (ICSE), 2024 IEEE International Conference on. :21-24 Aug, 2024

    Relation: 2024 IEEE International Conference on Semiconductor Electronics (ICSE)

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  5. 5
    مؤتمر
    Low-Loss, Temperature-Stable, and Li-Enriched Li2.12ZnTi3O8 Dielectric Ceramics for LTCC Applications with V2O5 Addition

    المؤلفون: Liu, Kui, Zhang, Huaiwu, Liu, Cheng, Li, Jie, Zhang, Dainan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    مؤتمر
    Microstructure Optimization of Magnetron-Sputtered Silver Films for Low-Temperature Interconnection

    المؤلفون: Lu, Dashi, Yang, Junzhe, Wang, Xiuqi, Ji, Hongjun

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Electrodeposition and Mechanical Properties of Gradient-Structured Cu with (220) Preferred Orientation

    المؤلفون: Li, Ruichong, Zhang, Zhiqiang, Li, Peifeng, Gao, Li-Yin, Liu, Zhi-Quan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Electroplated Low Temperature Self-Annealing Cu Film for Cu-Cu Bonding

    المؤلفون: Xie, Shichen, Du, Fuxin, Xiong, Zishan, Tu, King-Ning, Liu, Yingxia

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Improving the Microstructure of ZnO-Based Metal Oxide Varistors Using Cold Sintering

    المؤلفون: Chuong, Kayla, Liu, Yang, Graber, Lukas, Garten, Lauren M.

    المصدر: 2024 IEEE Electrical Insulation Conference (EIC) Electrical Insulation Conference (EIC), 2024 IEEE. :63-66 Jun, 2024

    Relation: 2024 IEEE Electrical Insulation Conference (EIC)

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  10. 10
    مؤتمر
    Effect of Physical Properties of Granular Sustainable-Porous Materials on Water Content Measurements by Using a Low-Cost Sensor

    المؤلفون: Papini, Nicola, Cecconi, Manuela, Placidi, Pisana, Scorzoni, Andrea, Tarantino, Alessandro

    المصدر: 2024 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Instrumentation and Measurement Technology Conference (I2MTC), 2024 IEEE International. :1-6 May, 2024

    Relation: 2024 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

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