المؤلفون: Khumprom, Phattara, Davila-Frias, Alex, Grewell, David, Buakum, Dollaya

المصدر: 2023 Annual Reliability and Maintainability Symposium (RAMS) Reliability and Maintainability Symposium (RAMS), 2023 Annual. :1-8 Jan, 2023

Relation: 2023 Annual Reliability and Maintainability Symposium (RAMS)

المؤلفون: Lopez, Daniela Andrea Ruiz^Aff13, Pirim, Harun^Aff14, Grewell, David^Aff15

المساهمون: Kacprzyk, Janusz, Series Editor^Aff1, Gomide, Fernando, Advisory Editor^Aff2, Kaynak, Okyay, Advisory Editor^Aff3, Liu, Derong, Advisory Editor^Aff4, Pedrycz, Witold, Advisory Editor^Aff5, Polycarpou, Marios M., Advisory Editor^Aff6, Rudas, Imre J., Advisory Editor^Aff7, Wang, Jun, Advisory Editor^Aff8, García Márquez, Fausto Pedro, editor^Aff9, Jamil, Akhtar, editor^Aff10, Hameed, Alaa Ali, editor^Aff11, Segovia Ramírez, Isaac, editor^Aff12

المصدر: Emerging Trends and Applications in Artificial Intelligence : Selected papers from the International Conference on Emerging Trends and Applications in Artificial Intelligence (ICETAI). 960:89-100

المؤلفون: Khumprom, Phattara, Yodo, Nita, Grewell, David

المصدر: 2020 Annual Reliability and Maintainability Symposium (RAMS) Reliability and Maintainability Symposium (RAMS), 2020 Annual. :1-7 Jan, 2020

Relation: 2020 Annual Reliability and Maintainability Symposium (RAMS)

المؤلفون: Dey, Arup, Rahman, Md Mahbubur, Yodo, Nita, Grewell, David

المصدر: In Materials Today Communications March 2023 34

المؤلفون: Covelli, Curtis, Yuan, Shichen, Grewell, David, Schmidt-Rohr, Klaus^{Aff2, IDs40194021012438_cor4}

المصدر: Welding in the World: The International Journal of Materials Joining. 66(5):961-971

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المؤلفون: Quader, Raihan, Dramko, Evan, Grewell, David, Randall, Jed, Narayanan, Lokesh Karthik

المصدر: 3D Printing & Additive Manufacturing; Jun2024, Vol. 11 Issue 3, p1151-1161, 11p

المؤلفون: Rahman, Md Mahfuzur, Byanju, Bibek, Grewell, David, Lamsal, Buddhi P.

المصدر: In Ultrasonics Sonochemistry June 2020 64

المؤلفون: Kadam, Dattatreya M., Thunga, Mahendra, Srinivasan, Gowrishanker, Wang, Sheng, Kessler, Michael R., Grewell, David, Yu, Chenxu, Lamsal, Buddhi

المصدر: In Food Packaging and Shelf Life September 2017 13:35-43

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