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1دورية أكاديمية
المؤلفون: Taylor, S.Aff1, IDs12540023013969_cor1, Janik, V., Grimes, R., Dashwood, R.
المصدر: Metals and Materials International. 29(9):2597-2604
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2دورية أكاديمية
المؤلفون: Galvin, C. O. T., Kuganathan, N., Barron, N. J., Grimes, R. W.
المصدر: Journal of Applied Physics; 4/28/2024, Vol. 135 Issue 16, p1-12, 12p
مصطلحات موضوعية: THERMOPHYSICAL properties, SPECIFIC heat capacity, DENSITY functional theory, BEHAVIORAL assessment, LATTICE constants
الشركة/الكيان: UNITED Nations
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3دورية أكاديمية
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4دورية أكاديمية
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5مؤتمر
المؤلفون: Punch, J., Walsh, E., Grimes, R., Jeffers, N., Kearney, D.
المصدر: 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on. :1-4 Apr, 2010
Relation: 2010 11th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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6تقرير
المؤلفون: Jackson, M. L., Burr, P. A., Grimes, R. W.
المصدر: Acta Cryst. (2016) B72, 277-280
مصطلحات موضوعية: Condensed Matter - Materials Science
URL الوصول: http://arxiv.org/abs/1603.04501
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7دورية أكاديمية
المؤلفون: Cleary, M., North, M. T., Van Lieshout, M., Brooks, D. A., Grimes, R., Hodes, M.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(12):2048-2058 Dec, 2013
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8مؤتمر
المؤلفون: Punch, J., Grimes, R., Heaslip, G., Galkin, T., Vakevainen, K., Kyyhkynen, V., Elonen, E.
المصدر: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :398-405 2005
Relation: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
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9تقرير
المؤلفون: Bell, B. D. C., Murphy, S. T., Burr, P. A., Grimes, R. W., Wenman, M. R.
المصدر: Journal of Applied Physics 117, 084901 (2015)
مصطلحات موضوعية: Condensed Matter - Materials Science
URL الوصول: http://arxiv.org/abs/1502.06883
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10تقرير
المؤلفون: Burr, P. A., Wenman, M. R., Gault, B., Moody, M. P., Ivermark, M., Rushton, M. J. D., Preuss, M., Edwards, L., Grimes, R. W.
المصدر: Journal of Nuclear Materials, 467 (2015) 320-331
مصطلحات موضوعية: Condensed Matter - Materials Science
URL الوصول: http://arxiv.org/abs/1501.06732
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