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1مؤتمر
المؤلفون: Verma, Vinod Kumar, Narayan Tripathi, Jai
المصدر: 2022 IEEE 19th India Council International Conference (INDICON) India Council International Conference (INDICON), 2022 IEEE 19th. :1-4 Nov, 2022
Relation: 2022 IEEE 19th India Council International Conference (INDICON)
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2مؤتمر
المؤلفون: Lukin, Kostyantyn, Palamarchuck, Volodymyr, Tatyanko, Dmytro, Zemlyanyi, Oleg, Zaets, Mykola, Lukin, Sergii, Shelekhov, Andrei, Sushchenko, Peter
المصدر: 2022 23rd International Radar Symposium (IRS) Radar Symposium (IRS), 2022 23rd International. :169-173 Sep, 2022
Relation: 2022 23rd International Radar Symposium (IRS)
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3دورية أكاديمية
المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 70(12):5405-5417 Dec, 2022
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4مؤتمر
المؤلفون: Kim, Youngwoo
المصدر: 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2020 IEEE MTT-S International Conference on. :1-4 Dec, 2020
Relation: 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)
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5مؤتمر
المؤلفون: Tomei, Sonia, Lupidi, Alberto, Stagliano, Daniele, Lischi, Stefano, Petri, Dario, Massini, Riccardo, Martorella, Marco
المصدر: 2020 21st International Radar Symposium (IRS) Radar Symposium (IRS), 2020 21st International. :197-201 Oct, 2020
Relation: 2020 21st International Radar Symposium (IRS)
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6دورية أكاديمية
المؤلفون: Kim, Y., Park, J., Kim, J., Hayashi, Y.
المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 62(6):2547-2557 Dec, 2020
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7دورية أكاديمية
المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 68(12):5055-5064 Dec, 2020
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8مؤتمر
المؤلفون: Souilem, Malek, Tripathi, Jai Narayan, Dghais, Wael, Belgacem, Hamdi
المصدر: 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2019 IEEE 23rd Workshop on. :1-4 Jun, 2019
Relation: 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI)
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9مؤتمر
المؤلفون: Kim, Youngwoo, Fujimoto, Daisuke, Nishiyama, Hikaru, Hayashi, Yu-Ichi, Lho, Daehwan, Park, Hyunwook, Kim, Joungho
المصدر: 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2019 12th International Workshop on the. :138-140 Oct, 2019
Relation: 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
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10مؤتمر
المصدر: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2018 IEEE. :1-3 Dec, 2018
Relation: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)