المؤلفون: Haksoo Han, Hyunsoo Chung, Sungkook Park, Yungil Joe, Sungsoo Park, Gwanchong Joo, Nam Hwang, Hee Tae Lee, Kang Seungoo, Song Min-Kyu

المصدر: Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Circuits and systems, Asia Pacific conference Circuits and Systems, 1996., IEEE Asia Pacific Conference on. :421-424 1996

Relation: Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems

المؤلفون: Dong Goo Kim, Haksoo Han, Seong Su Park, Gwanchong Joo

المصدر: 1995 Proceedings. 45th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1995. Proceedings., 45th. :872-875 1995

Relation: 1995 Proceedings. 45th Electronic Components and Technology Conference

المؤلفون: Gwanchong Joo, Song Min-Kyu, Hee Tae Lee, Sungsoo Park, Kang Seungoo, Nam Eung Hwang, Hyun Soo Chung, Sungkook Park, Yung-Il Joe, Haksoo Han

المصدر: Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems.

مصطلحات موضوعية: Wire bonding, Reflow soldering, Interconnection, Fabrication, Materials science, chemistry, Soldering, Electronic engineering, chemistry.chemical_element, Composite material, Layer (electronics), Flip chip, Indium

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0c4be738fc7c162b68b7e478f83546a4
https://doi.org/10.1109/apcas.1996.569305

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