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1دورية أكاديمية
المؤلفون: M.-L. Pourteau, A. Gharbi, P. Brianceau, J.-A. Dallery, F. Laulagnet, G. Rademaker, R. Tiron, H.-J. Engelmann, J. von Borany, K.-H. Heinig, M. Rommel, L. Baier
المصدر: Micro and Nano Engineering, Vol 9, Iss , Pp 100074- (2020)
مصطلحات موضوعية: Single-electron-transistor, Multilayer nanopillars, Si nanodots, E-beam lithography, ICP-RIE, EFTEM, Electronics, TK7800-8360, Technology (General), T1-995
وصف الملف: electronic resource
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المؤلفون: J von Borany, H-J Engelmann, K-H Heinig, E Amat, G Hlawacek, F Klüpfel, R Hübner, W Möller, M-L Pourteau, G Rademaker, M Rommel, L Baier, P Pichler, F Perez-Murano, R Tiron
المصدر: Semiconductor Science and Technology. 38:055011
مصطلحات موضوعية: Materials Chemistry, Electrical and Electronic Engineering, Condensed Matter Physics, Electronic, Optical and Magnetic Materials
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المؤلفون: A del Moral, E Amat, H-J Engelmann, M-L Pourteau, G Rademaker, D Quirion, N Torres-Herrero, M Rommel, K-H Heinig, J von Borany, R Tiron, J Bausells, F Perez-Murano
المصدر: Semiconductor Science and Technology 37(2022), 125014-125023
مصطلحات موضوعية: hybrid circuit, MOSFET, CMOS, Materials Chemistry, Electrical and Electronic Engineering, Condensed Matter Physics, single electron transistor, vertical nanopillar, Electronic, Optical and Magnetic Materials
وصف الملف: application/pdf
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المؤلفون: Ehrenfried Zschech, H. Stegmann, H. Geisler, Brett M. Tracy, E Langer, H J Engelmann, Gerd Schneider, A M Meyer
المصدر: Microscopy of Semiconducting Materials 2003 ISBN: 9781351074636
مصطلحات موضوعية: Interconnection, Scanning probe microscopy, Reliability (semiconductor), law, Computer science, Transistor, Hardware_INTEGRATEDCIRCUITS, Process (computing), Integrated circuit, Root cause, Critical dimension, law.invention, Reliability engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::67316e1fdfa175ad4de69ffca95cd62f
https://doi.org/10.1201/9781351074636-112 -
5دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
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المؤلفون: Marcel Michling, Dieter Schmeisser, Massimo Tallarida, H. J. Engelmann, M. Weisheit, Krzysztof Kolanek
المصدر: Journal of Nanoparticle Research. 13:5975-5983
مصطلحات موضوعية: Materials science, Thin layers, business.industry, Bilayer, Bioengineering, Nanotechnology, General Chemistry, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Atomic layer deposition, Band bending, X-ray photoelectron spectroscopy, Modeling and Simulation, Atomic layer epitaxy, Optoelectronics, General Materials Science, Thin film, business, Layer (electronics)
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7دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
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المؤلفون: H.-J. Engelmann, Y. Ritz, B. Volkmann, E. Zschech, Q. de Robiliard, Heiko Stegmann, Holger Saage
المصدر: Microscopy Today. 11:22-25
مصطلحات موضوعية: Sample handling, Materials science, General Computer Science, Ion beam, business.industry, Scanning electron microscope, Sample (graphics), Focused ion beam, Ion, 03 medical and health sciences, 0302 clinical medicine, 030220 oncology & carcinogenesis, Cathode ray, Optoelectronics, Sample preparation, 030223 otorhinolaryngology, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a9b7d01dabcf3b13639bc324ae810ac4
https://doi.org/10.1017/s1551929500052457 -
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المؤلفون: C. Wenzel, H.-J. Engelmann
المصدر: Vakuum in Forschung und Praxis. 13:20-28
مصطلحات موضوعية: Engineering, Diffusion barrier, business.industry, Copper-wiring, Optoelectronics, Nanotechnology, Interconnect technology, Condensed Matter Physics, business, Die (integrated circuit), Surfaces, Coatings and Films
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c3c83935963ca3098ad15dffb9e8bace
https://doi.org/10.1002/1522-2454(200101)13:1<20::aid-vipr20>3.0.co;2-n -
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المؤلفون: M. F. Shehata, S. Schwarz, M. Uhlemann, H. J. Engelmann
المصدر: Materials Science and Technology. 13:1016-1022
مصطلحات موضوعية: Austenite, Materials science, Hydrogen, Mechanical Engineering, Metallurgy, technology, industry, and agriculture, chemistry.chemical_element, Intergranular corrosion, Condensed Matter Physics, Nitrogen, chemistry.chemical_compound, chemistry, Mechanics of Materials, Ultimate tensile strength, General Materials Science, Chromium nitride, Ductility, Hydrogen embrittlement