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1دورية أكاديمية
المؤلفون: H.H. Lin, L.Y. Han, H.L. Zhang, C.J. Zheng, B. Xie, Y.Z. Chen
المصدر: Journal of Lipid Research, Vol 47, Iss 4, Pp 824-831 (2006)
مصطلحات موضوعية: lipid-protein interactions, lipid-modifying enzymes, lipid metabolism, support vector machine, Biochemistry, QD415-436
وصف الملف: electronic resource
Relation: http://www.sciencedirect.com/science/article/pii/S002222752033279X; https://doaj.org/toc/0022-2275
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2دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
3
المؤلفون: J.H. Jhan, H.L. Ke, W.C. Hsu, P.I. Liang, Y.C. Lee, H.H. Lin, T.Y. Tang, Y.R. Wu, A.M. Huang, H.Y. Lee, H.C. Yeh, W.J. Wu, C.C. Li, W.M. Li
المصدر: European Urology Open Science. 44:S229
مصطلحات موضوعية: Urology
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4
المؤلفون: C.S. Wang, W.C. Hsu, J.H. Jhan, C.W. Chang, Y.R. Wu, Y.C. Lee, W.M. Li, L.L. Chang, A.M. Huang, H.H. Lin, W.J. Wu, C.C. Li, H.L. Ke
المصدر: European Urology Open Science. 44:S230
مصطلحات موضوعية: Urology
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5دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
6
المؤلفون: C-H Chen, C-H Tsai, P-F Lai, S-W Lan, Y-C Lu, P-W Hsiao, H-H Lin, S-R Wu, T-S Cheng, H-P Huang, C-J Ko, H.H. Lin, T-W Hsu, M-S Lee, H-Y Shyu
المصدر: Oncogene. 36:4597-4609
مصطلحات موضوعية: Male, 0301 basic medicine, Cancer Research, medicine.medical_specialty, Mice, SCID, urologic and male genital diseases, Molecular oncology, Dinoprostone, Metastasis, Mice, 03 medical and health sciences, Prostate cancer, Sulindac, 0302 clinical medicine, Growth factor receptor, Cell Movement, Internal medicine, Tumor Cells, Cultured, Genetics, medicine, Animals, Humans, Neoplasm Invasiveness, Matriptase, Neoplasm Metastasis, Molecular Biology, Inflammation, Cyclooxygenase 2 Inhibitors, biology, Serine Endopeptidases, Membrane Proteins, Prostatic Neoplasms, Cancer, Cell cycle, medicine.disease, Xenograft Model Antitumor Assays, HEK293 Cells, 030104 developmental biology, Endocrinology, Celecoxib, Cyclooxygenase 2, Apoptosis, 030220 oncology & carcinogenesis, Cancer research, biology.protein, Interleukin-2
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7
المؤلفون: Wei-Kuo Han, H.H. Lin, June-Chien Chang, Y. T. Lin, Kuo-Shu Kao, Chih-Ming Tzeng, T. C. Chang
المصدر: 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD).
مصطلحات موضوعية: System in package, Microcontroller, Computer science, Power module, Gate driver, Electromagnetic compatibility, Electronic engineering, Inverter, Signal integrity, Energy consumption
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bae8b93ff0f59414a6c96a4997ac9f32
https://doi.org/10.1109/ispsd.2019.8757581 -
8
المؤلفون: Fang-Jun Leu, T. C. Chang, Chih-Ming Tzeng, P. K. Chiu, H.H. Lin, Sheng-Tsai Wu, Chun-Kai Liu, Yu-Chung Chen, Hung-Kun Lee, T.T Lin, Yu-Sheng Lin
المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
مصطلحات موضوعية: Materials science, business.industry, Thermal resistance, Heat sink, Chip, computer.software_genre, Temperature measurement, Power (physics), Simulation software, chemistry.chemical_compound, chemistry, Power module, Silicon carbide, Optoelectronics, business, computer
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::517611d1a8ff6340d278086287b814f6
https://doi.org/10.1109/impact.2018.8625834 -
9
المؤلفون: S.F. Hsu, K. Anai, T. Sakaue, K.H. Cheng, H.H. Lin, J. L. Jo, S. Yamauchi, Su-Yu Fun, C.M. Tseng, Wei-Kuo Han, H.W. Cheng, J. Y. Chang, T. C. Chang
المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
مصطلحات موضوعية: 010302 applied physics, Materials science, Thermal resistance, 020208 electrical & electronic engineering, Sintering, 02 engineering and technology, Insulated-gate bipolar transistor, Semiconductor device, 01 natural sciences, Engineering physics, Die (integrated circuit), Reliability (semiconductor), visual_art, 0103 physical sciences, MOSFET, 0202 electrical engineering, electronic engineering, information engineering, visual_art.visual_art_medium, Ceramic
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4b63710b2acaa2b9b73e549fa0281981
https://doi.org/10.1109/impact.2018.8625823 -
10
المؤلفون: H.H. Lin, J. Y. Chang, T. C. Chang, Fang-Jun Leu, P. K. Chiu, Kuo-Shu Kao, T. J. Yu
المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
مصطلحات موضوعية: Materials science, Packaging engineering, business.industry, Thermal grease, Temperature cycling, Integrated circuit, Thermal conduction, Automotive engineering, law.invention, Motor drive, Reliability (semiconductor), law, Power module, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6eda17b4041177ab4d3063987a06bca2
https://doi.org/10.1109/impact.2018.8625745