يعرض 1 - 10 نتائج من 498 نتيجة بحث عن '"HERMETIC sealing"', وقت الاستعلام: 0.85s تنقيح النتائج
  1. 1
    مؤتمر
    Novel Method of Hermetic Sealing of Electronics Package by Electron Beam Welding

    المؤلفون: BV, Kiran Kumar, J, Pradyumna, DN, Abhishek

    المصدر: 2023 16th International Conference on Sensing Technology (ICST) Sensing Technology (ICST), 2023 16th International Conference on. :1-6 Dec, 2023

    Relation: 2023 16th International Conference on Sensing Technology (ICST)

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  2. 2
    مؤتمر
    Achieving Spaceworthiness for Large-Size LTCC Packaging of Microwave MCM

    المؤلفون: Prajapati, Ishwarlal, Hegde, Ravindra K., Pandya, Shilpa, Lal, Ajay Kumar

    المصدر: 2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON) Microwaves, Antennas, and Propagation Conference (MAPCON), 2023 IEEE. :1-4 Dec, 2023

    Relation: 2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON)

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  3. 3
    مؤتمر
    Wafer Level Capping Technology for Vacuum Packaging of Microbolometers

    المؤلفون: Zoschke, Kai, Manier, Charles Alix, Oppermann, Hermann, Meier, Dirk, Malik, Nishant, Zakizade, Elahe, Michel, Marvin, Roy, Avisek, Nguyen, Hoang-Vu, Nguyen, Thanh-Phuc

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1571-1578 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  4. 4
    دورية أكاديمية
    Recent Progress in High-Efficiency Transparent Vacuum Insulation Technologies for Carbon Neutrality

    المؤلفون: Jung, Wonyeong, Kim, Dohyung, Ko, Seung HwanAff1, Aff2, Aff3, IDs4068402400623x_cor3

    المصدر: International Journal of Precision Engineering and Manufacturing-Green Technology. :1-22

    Find this article in full text from Springer Verlag. Full Text Finder
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  5. 5
    مؤتمر
    Vacuum Packaging of MEMS-based Infrared Detectors

    المؤلفون: Roy, Avisek, Nguyen, Hoang-Vu, Xia, Hexin, Papatzacos, Phillip, Ohlckers, Per, Aasmundtveit, Knut Eilif

    المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :410-415 Sep, 2022

    Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

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  6. 6
    دورية أكاديمية
    New Aluminum Lug Closure Reduces Removal Torque while Ensuring Hermetic Seals in Glass Jars.

    المؤلفون: Shuang Qiu, Natasha Saikia, Padilla-Zakour, Olga I.

    المصدر: Food Protection Trends; Jul/Aug2024, Vol. 44 Issue 4, p273-282, 10p

    مصطلحات موضوعية: FOOD packaging, HERMETIC sealing, TORQUE, DEIONIZATION of water, ALUMINUM, GLASS

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  7. 7
    مؤتمر
    High density packaging techniques for miniaturization of satellite RF and microwave subsystems: Attachments, Interconnections and Hermetic sealing

    المؤلفون: Chippalkatti, Vinod S, Biradar, R C, Shivarudraswami, Y, Mathan, N

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :357-362 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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  8. 8
    دورية أكاديمية
    A Ka-Band Two-Channel Two-Beam Receiver Based on a Substrate-Integrated Suspended Line.

    المؤلفون: Xu, Hui, Ma, Kaixue, Li, Shuantao, Liu, Gaojian, Wang, Yongqiang

    المصدر: Electronics (2079-9292); Apr2024, Vol. 13 Issue 8, p1582, 15p

    مصطلحات موضوعية: PHASED array antennas, HERMETIC sealing

    Find this article in full text from ProQuest Full Text Finder
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  9. 9
    دورية أكاديمية
    Comprehensive Study of Natural Radioactivity in Building Materials: A Case Study in Ica, Peru.

    المؤلفون: Liza, Rafael, Pereyra, Patrizia, Muñoz, Daniel, Viera, Victor, Herrera, Maria Elena López, Rojas, Jhonny, Palacios, Daniel, Díaz, Félix, Cerna, Nhell, Rojas, Segundo, Sajo-Bohus, Laszlo

    المصدر: Atmosphere; Mar2024, Vol. 15 Issue 3, p279, 15p

    مصطلحات موضوعية: RADIOACTIVITY, NATURAL radioactivity, CONSTRUCTION materials, HERMETIC sealing, RADIOISOTOPES, RADON, DETECTION limit

    مصطلحات جغرافية: PERU

    Find this article in full text from ProQuest Full Text Finder
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  10. 10
    مؤتمر
    High Light Power Density DUV-LED Packaging Using High Density TSV in Silicon Cavity and Laser-Glass-Frit-Bonded Glass Cap

    المؤلفون: Chiba, Hirofumi, Suzuki, Yukio, Yasuda, Yoshiaki, Gong, Tianjiao, Tanaka, Shuji

    المصدر: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) SSolid-State Sensors, Actuators and Microsystems (Transducers), 2021 21st International Conference on. :1162-1165 Jun, 2021

    Relation: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

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