المؤلفون: Shamanna, M., Abuayob, E., Aenuganti, G., Alvares, C., Antony, J., Bahudhanam, A., Chandran, A., Chew, P., Chatterjee, A., Chauhan, B., Dandeti, N., Desai, J., Doyle, M., Dmukauskas, T., Farache, P., Fetzer, E., Fischer, K., Hack, P., Greenzweig, Y., Giacobbe, J., Hafez, W., Haralson, E., Hegde, A., Illa, A., Islam, M., Jain, S., Jang, M., Nguyen, J., Tong, T., Jiang, L., Karl, E., Kalangi, P., Khoo, G., Krishnamoorthy, A., Kuns, B., Li, W., Livengood, R., Malik, T., Priyanka, R., Faraby, H., Maymon, Y., Mistry, K., Morgan, K., Natarajan, S., Nevo, O., Oh, M., Pardy, P., Park, J., Penmatsa, P., Phelps, B., Peterson, C., Rajappa, S., Raveh, A., Rezaie, A, Ravishankar, T., Ramaswamy, R., Reddy, S., Saha, R., Sen, S., Sanchez, R., Sanaga, R., Simkhovich, B., Sell, B., Senger, M., Schnarch, B., Seshadri, M., Sidorov, O., Subramaniam, S., Subramanian, K., Truong, B., Bangalore, S., Hicks, J., Venkatesh, S., Christensen, D., Bhargav, K., Haartman, M. Von, Joshi, P., Zickel, S., Lin, C-H, Huening, J., Wu, T-H, Bakken, N., Afzal, A., Raman, A., Rao, Sj., Kawar, V., Neirynck, J., Bradley, D., Duwe, M., Wu, S., Patil, V., Bayoumy, M.

المصدر: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023

Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

المؤلفون: Haartman, M. von, Westlinder, J., Wu, D., Malm, B.G., Hellström, P.-E., Olsson, J., Östling, M.

المصدر: In Solid State Electronics June 2005 49(6):907-914

المؤلفون: Haartman, M. von

مصطلحات موضوعية: voi, maatalous, valmistus

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od______1593::0641d913b34c1aa3071b60245e1a28ec
http://hdl.handle.net/10138/44703