المؤلفون: Seonho Jeong, Yeongil Shin, Jongmin Jeong, Seunghun Jeong, Haedo Jeong

المصدر: Materials, Vol 17, Iss 8, p 1817 (2024)

مصطلحات موضوعية: chemical mechanical planarization (CMP), multivariate gaussian normal distribution (MVN), asperity wear, mathematical model, contact mode, probability density function (PDF), Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/17/8/1817; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/6ff580949fe14e74a66330ff12795465

المؤلفون: Taekyung Lee, Haedo Jeong, Sangjik Lee, Hanchul Cho, Doyeon Kim, Hyoungjae Kim

المصدر: Applied Sciences, Vol 11, Iss 9, p 3950 (2021)

مصطلحات موضوعية: lapping, groove density, contact interface, oil film, wafer, boundary lubrication, Technology, Engineering (General). Civil engineering (General), TA1-2040, Biology (General), QH301-705.5, Physics, QC1-999, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2076-3417/11/9/3950; https://doaj.org/toc/2076-3417

URL الوصول: https://doaj.org/article/2912319c47b84ad3ba235aede47f62c9

المؤلفون: Seonho Jeong, Kyeongwoo Jeong, Jinuk Choi, Haedo Jeong

المصدر: Applied Sciences, Vol 11, Iss 4, p 1507 (2021)

مصطلحات موضوعية: chemical mechanical planarization (CMP), pad temperature, asperity angle, Micro-CT, Technology, Engineering (General). Civil engineering (General), TA1-2040, Biology (General), QH301-705.5, Physics, QC1-999, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2076-3417/11/4/1507; https://doaj.org/toc/2076-3417

URL الوصول: https://doaj.org/article/e004d4e40f57481290633ec0dce5cd9d

المؤلفون: Taekyung Lee, Haedo Jeong, Sangjik Lee, Doyeon Kim, Hyoungjae Kim

المصدر: Micromachines, Vol 11, Iss 8, p 775 (2020)

مصطلحات موضوعية: groove density, boundary lubrication, lapping characteristic, oil film, sapphire substrate, microabrasive, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/11/8/775; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/8f14657ab6f940549be58be2d561e472

المؤلفون: Hobin JEONG, Hyunseop LEE, Sungha CHOI, Youngkyun LEE, Haedo JEONG

المصدر: Journal of Advanced Mechanical Design, Systems, and Manufacturing, Vol 6, Iss 1, Pp 113-120 (2012)

مصطلحات موضوعية: microtopography, chemical mechanical polishing (cmp), real contact area, surface roughness, bearing area curve, Engineering machinery, tools, and implements, TA213-215, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.jstage.jst.go.jp/article/jamdsm/6/1/6_1_113/_pdf/-char/en; https://doaj.org/toc/1881-3054

URL الوصول: https://doaj.org/article/55a4b391f21045e5ac17b95dc2c64cfc

المؤلفون: Karaki-Doy, T., Haedo Jeong, Nakagawa, T., Ohmori, H., Kasai, T.

المصدر: Proceedings of International Symposium on Semiconductor Manufacturing Semiconductor manufacturing Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on. :214-217 1995

Relation: Proceedings of International Symposium on Semiconductor Manufacturing

المؤلفون: Hokyoung Jung, Seonho Jeong, Youngwook Park, Yeongil Shin, Haedo Jeong

المصدر: International Journal of Precision Engineering and Manufacturing. 24:25-32

مصطلحات موضوعية: Mechanical Engineering, Electrical and Electronic Engineering, Industrial and Manufacturing Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2134e533e069be826387b39922a9e63e
https://doi.org/10.1007/s12541-022-00711-5

المؤلفون: Seongnyeong Heo, Seonho Jeong, Minji Kim, Youngwook Park, Haedo Jeong

المصدر: Journal of the Korean Society for Precision Engineering. 39:675-682

مصطلحات موضوعية: Mechanical Engineering, Safety, Risk, Reliability and Quality, Industrial and Manufacturing Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4ac5e5d685f56474566439e28c60d627
https://doi.org/10.7736/jkspe.022.036

المؤلفون: Minji Kim, Seonho Jeong, Yeongil Shin, Youngwook Park, Haedo Jeong

المصدر: Journal of the Korean Society for Precision Engineering. 39:547-555

مصطلحات موضوعية: Mechanical Engineering, Safety, Risk, Reliability and Quality, Industrial and Manufacturing Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1009e14c55704106cc664b3fc6d4616d
https://doi.org/10.7736/jkspe.022.028

المؤلفون: Hyunseop Lee, Haedo Jeong, Hyoungjae Kim

المصدر: International Journal of Precision Engineering and Manufacturing-Green Technology

مصطلحات موضوعية: Consumables, Hardware_MEMORYSTRUCTURES, Renewable Energy, Sustainability and the Environment, business.industry, Computer science, Semiconductor device fabrication, Slurry, Mechanical Engineering, Material removal, Review, ComputerSystemsOrganization_PROCESSORARCHITECTURES, Industrial and Manufacturing Engineering, Integrated devices, Polishing pad, Sustainability, Management of Technology and Innovation, Chemical-mechanical planarization, Hybrid CMP system, Chemical mechanical polishing (CMP), General Materials Science, Process engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::48a5dda098fc8b88967e82d5291fa98a
http://europepmc.org/articles/PMC8617369