المؤلفون: Narayanan, P., Ambrogio, S., Okazaki, A., Hosokawa, K., Tsai, H., Nomura, A., Yasuda, T., Mackin, C., Lewis, S.C., Friz, A., Ishii, M., Kohda, Y., Mori, H., Spoon, K., Khaddam-Aljameh, R., Saulnier, N., Bergendahl, M., Demarest, J., Brew, K.W., Chan, V., Choi, S., Ok, I., Ahsan, I., Lie, F.L., Haensch, W., Narayanan, V., Burr, G.W.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(12):6629-6636 Dec, 2021

المؤلفون: Kim, Y., Seo, S., Consiglio, S., Jamison, P., Higuchi, H., Rasch, M., Wu, E.Y., Kong, D., Saraf, I., Catano, C., Muralidhar, R., Nguyen, S., DeVries, S., Van der Straten, O., Sankarapandian, M., Pujari, R.N., Gasasira, A., Mcdermott, S.M., Miyazoe, H., Koty, D., Yang, Q., Yan, H., Clark, R., Tapily, K., Engelmann, S., Robison, R.R., Wajda, C., Mosden, A., Tsunomura, T., Soave, R., Saulnier, N., Haensch, W., Leusink, G., Biolsi, P., Narayanan, V., Ando, T.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 42(5):759-762 May, 2021

المؤلفون: Rasch, M.J., Gokmen, T., Haensch, W.

المصدر: IEEE Design & Test IEEE Des. Test Design & Test, IEEE. 37(2):19-29 Apr, 2020

المؤلفون: Narayanan, P., Ambrogio, S., Okazaki, A., Hosokawa, K., Tsai, H., Nomura, A., Yasuda, T., Mackin, C., Lewis, S. C., Friz, A., Ishii, M., Kohda, Y., Mori, H., Spoon, K., Khaddam-Aljameh, R., Saulnier, N., Bergendahl, M., Demarest, J., Brew, K. W., Chan, V., Choi, S., Ok, I., Ahsan, I., Lie, F. L., Haensch, W., Narayanan, V., Burr, G. W.

المصدر: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Technology

المؤلفون: Kim, Y., Seo, S.-C., Jamison, P., Consiglio, S., Higuchi, H., Miyazoe, H., Solomon, P., Kim, S., Gokmen, T., Tapily, K., Clark, R. D., Tsunomura, T., Wajda, C. S., Haensch, W., Soave, R., Leusink, G. J., Narayanan, V., Ando, T.

المصدر: 2021 Silicon Nanoelectronics Workshop (SNW) Silicon Nanoelectronics Workshop (SNW), 2021. :1-2 Jun, 2021

Relation: 2021 Silicon Nanoelectronics Workshop (SNW)

المؤلفون: Haensch, W., Gokmen, T., Puri, R.

المصدر: Proceedings of the IEEE Proc. IEEE Proceedings of the IEEE. 107(1):108-122 Jan, 2019

المؤلفون: Rosenberg, J. C., Horst, F., Khater, M., Anderson, F. G., Leidy, R., Barwicz, T., Gill, D., Kiewra, E., Martin, Y., Orcutt, J. S., Stricker, A. D., Whiting, C., McLean, K., Porth, B., Xiong, C., Feilchenfeld, N., Giewont, K., Nummy, K., Offrein, B. J., Haensch, W., Green, W. M. J.

المصدر: 2017 European Conference on Optical Communication (ECOC) Optical Communication (ECOC), 2017 European Conference on. :1-3 Sep, 2017

Relation: 2017 European Conference on Optical Communication (ECOC)

المؤلفون: Kohda, Y., Li, Y., Hosokawa, K., Kim, S., Khaddam-Aljameh, R., Ren, Z., Solomon, P., Gokmen, T., Rajalingam, S., Baks, C., Haensch, W., Leobandung, E.

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :36.2.1-36.2.4 Dec, 2020

Relation: 2020 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Ishii, M., Kim, S., Lewis, S., Okazaki, A., Okazawa, J., Ito, M., Rasch, M., Kim, W., Nomura, A., Shin, U., Hosokawa, K., BrightSky, M., Haensch, W.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :14.2.1-14.2.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Orcutt, J. S., Gill, D. M., Proesel, J., Ellis-Monaghan, J., Horst, F., Barwicz, T., Xiong, C., Anderson, F. G., Agrawal, A., Martin, Y., Baks, C. W., Khater, M., Rosenberg, J. C., Sacher, W. D., Hofrichter, J., Kiewra, E., Stricker, A. D., Libsch, F., Offrein, B., Meghelli, M., Feilchenfeld, N. B., Haensch, W., Green, W. M. J.

المصدر: 2016 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2016. :1-3 Mar, 2016

Relation: 2016 Optical Fiber Communications Conference and Exhibition (OFC)