المؤلفون: Ngoune, Bernard Bobby, Kreddia, Meriem, Bernardini, Sandrine, Bendahan, Marc, Cloutet, Eric, Bila, Stephane, Bondu, Benoit, Dejous, Corinne, Hallil, Hamida

المصدر: 2024 IEEE Applied Sensing Conference (APSCON) Applied Sensing Conference (APSCON), 2024 IEEE. :1-4 Jan, 2024

Relation: 2024 IEEE Applied Sensing Conference (APSCON)

المؤلفون: Ngoune, Bernard Bobby, Hallil, Hamida, George, Julien, Dejous, Corinne, Cloutet, Eric, Bondu, Benoit, Bila, Stephane, Baillargcar, Dominique

المصدر: 2022 IEEE Sensors Sensors, 2022 IEEE. :1-4 Oct, 2022

Relation: 2022 IEEE Sensors

المؤلفون: Yang, Yang, Dejous, Corinne, Hallil, Hamida

المصدر: 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS) Electronics, Circuits and Systems (ICECS), 2022 29th IEEE International Conference on. :1-4 Oct, 2022

Relation: 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS)

المؤلفون: Ngoune, Bernard Bobby, Hallil, Hamida, Bila, Stephane, Baillargeat, Dominique, Bondu, Benoit, Cloutet, Eric, Dejous, Corinne

المصدر: 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS) Electronics, Circuits and Systems (ICECS), 2022 29th IEEE International Conference on. :1-4 Oct, 2022

Relation: 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS)

المؤلفون: Ngoune, Bernard Bobby, Hallil, Hamida, Deletage, Jean-Yves, George, Julien, Dejous, Corinne, Cloutet, Eric, Bila, Stephane, Baillargeat, Dominique

المصدر: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2022 Symposium on. :1-4 Jul, 2022

Relation: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Yang, Yang, Dejous, Corinne, Hallil, Hamida

المصدر: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2022 Symposium on. :1-4 Jul, 2022

Relation: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: George, Julien, Abdelghani, Aymen, Bahoumina, Prince, Cloutet, Eric, Bernardin, Nicolas, Frigui, Kamel, Hallil, Hamida, Dejous, Corinne, Bila, Stephane, Baillargeat, Dominique

المصدر: 2021 IEEE MTT-S International Microwave Symposium (IMS) Microwave Symposium (IMS), 2021 IEEE MTT-S International. :93-96 Jun, 2021

Relation: 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

المؤلفون: George, Julien, Hallil, Hamida, Dejous, Corinne, Cloutet, Eric, Perigaud, Aurelien, Bila, Stephane, Baillargeat, Dominique

المصدر: 2020 IEEE SENSORS SENSORS, 2020 IEEE. :1-4 Oct, 2020

Relation: 2020 IEEE SENSORS

المؤلفون: RUBE, Maxence, TAMARIN, Ollivier, SEBELOUE, Martine, HALLIL, Hamida, LINGUET, Laurent, REBIERE, Dominique, DEJOUS, Corinne

المصدر: 2020 IEEE SENSORS SENSORS, 2020 IEEE. :1-4 Oct, 2020

Relation: 2020 IEEE SENSORS

المؤلفون: RUBE, Maxence, TAMARIN, Ollivier, HALLIL, Hamida, CONEDERA, Veronique, LABORDE, Adrian, LACHAUD, Jean-Luc, SEBELOUE, Martine, LINGUET, Laurent, REBIERE, Dominique, DEJOUS, Corinne

المصدر: 2019 IEEE SENSORS SENSORS, 2019 IEEE. :1-4 Oct, 2019

Relation: 2019 IEEE SENSORS