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1مؤتمر
المؤلفون: Zafar, S., Picunko, T., Cabral, C., Hopstaken, Marinus, Solomon, P., Hamann, H. F.
المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Relation: 2023 International Electron Devices Meeting (IEDM)
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2دورية أكاديمية
المؤلفون: Kaiser, T.K., Hamann, H.
المصدر: IEEE Transactions on Robotics IEEE Trans. Robot. Robotics, IEEE Transactions on. 38(6):3582-3601 Dec, 2022
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3دورية أكاديمية
المؤلفون: Hamann, H., Reina, A.
المصدر: IEEE Transactions on Computers IEEE Trans. Comput. Computers, IEEE Transactions on. 71(6):1453-1465 Jun, 2022
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4مؤتمر
المؤلفون: Van Rooijen, L., Hamann, H.
المصدر: 2016 IEEE 24th International Requirements Engineering Conference Workshops (REW) REW Requirements Engineering Conference Workshops (REW), IEEE International. :3-9 Sep, 2016
Relation: 2016 IEEE 24th International Requirements Engineering Conference Workshops (REW)
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5مؤتمر
المؤلفون: Yarlanki, S., Rajendran, B., Hamann, H.
المصدر: 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on. :38-42 May, 2012
Relation: 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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6مؤتمر
المؤلفون: Klein, L. J., Singh, P. J., Schappert, M., Griffel, Marc, Hamann, H. F.
المصدر: 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE. :21-26 Mar, 2011
Relation: 2011 IEEE/CPMT 27th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM)
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7مؤتمر
المؤلفون: Eickemeyer, R., Floyd, M., Griswell, J., Mericas, A., Sinharoy, B., Bose, P., Ghiasi, S., Hamann, H., Jacobson, H., Keller, T., Zyuban, V.
المصدر: 2008 IEEE Hot Chips 20 Symposium (HCS) Hot Chips 20 Symposium (HCS), 2008 IEEE. :1-31 Aug, 2008
Relation: 2008 IEEE Hot Chips 20 Symposium (HCS)
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8مؤتمر
المؤلفون: Takiguchi, I., Tamura, T., Yazawa, K., Coffin, J., Yarmchuk, E., Harvey, P., Wang, M., Weger, A., Hamann, H., Gaynes, M., Questad, D., Wakil, J.
المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :289-296 2006
Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems
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9دورية أكاديمية
المؤلفون: Hamann, H. F., Lacey, J. A., O'Boyle, M., Schmidt, R. R., Iyengar, M.
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 31(2):444-448 Jun, 2008
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10دورية أكاديميةInvestigation of the Impact of Power Granularity on Chip Thermal Modeling Using White Noise Analysis
المؤلفون: Etessam-Yazdani, K., Asheghi, M., Hamann, H. F.
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 31(1):211-215 Mar, 2008
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