المؤلفون: Kim, Jun-Bae, Kim, Taeho, Yoon, Chang Soo, Kim, Janghoo, Kwon, Byungjin, Han, Youngbong, Jin, Jungho, Lee, Seungbae, Sung, Yoo-Chang, Bae, Seung-Jun, Lim, Daihyun, Oh, Tae-Young

المصدر: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2024 IEEE 28th Workshop on. :1-4 May, 2024

Relation: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI)

المؤلفون: Jin, Jungho, Han, Youngbong, Kown, Byungjin, Jang, Iloh, Lee, Namhyun, Lee, Seungbae, Hwang, Yuchul, Kim, Hoosung, Pae, Sangwoo

المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-4 Jul, 2022

Relation: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Le, Hung Khac, van Nguyen, Hoang, Han, Youngbong, Kim, SoYoung

المصدر: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020 IEEE International Symposium on. :578-580 Jul, 2020

Relation: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

المؤلفون: Lee, SeungHyuk, Huynh, Hai Au, Han, YoungBong, Choi, DaeHan, Kim, SoYoung

المصدر: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), 2019 Joint International Symposium on. :266-269 Jun, 2019

Relation: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)

المؤلفون: Han, Youngbong, Lee, SeungHyuk, Huynh, Hai Au, Kim, SoYoung

المصدر: 2019 International Conference on Electronics, Information, and Communication (ICEIC) Electronics, Information, and Communication (ICEIC), 2019 International Conference on. :1-4 Jan, 2019

Relation: 2019 International Conference on Electronics, Information, and Communication (ICEIC)

المؤلفون: Hwang, JongTae, Han, YoungBong, Park, HyunHo, Nah, WanSoo, Kim, SoYoung

المصدر: 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2015 10th International Workshop on the. :147-151 Nov, 2015

Relation: 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

المؤلفون: Han, YoungBong, Huynh, Hai Au, Kim, SoYoung

المصدر: 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) Electromagnetic Compatibility (APEMC), 2017 Asia-Pacific International Symposium on. :244-246 Jun, 2017

Relation: 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

المؤلفون: Han, YoungBong, Huynh, Hai Au, Kim, SoYoung

المصدر: 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Electrical Design of Advanced Packaging and Systems (EDAPS), 2016 IEEE. :123-125 2016

Relation: 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.