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1مؤتمر
المؤلفون: Kim, Jun-Bae, Kim, Taeho, Yoon, Chang Soo, Kim, Janghoo, Kwon, Byungjin, Han, Youngbong, Jin, Jungho, Lee, Seungbae, Sung, Yoo-Chang, Bae, Seung-Jun, Lim, Daihyun, Oh, Tae-Young
المصدر: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2024 IEEE 28th Workshop on. :1-4 May, 2024
Relation: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI)
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2مؤتمر
المؤلفون: Jin, Jungho, Han, Youngbong, Kown, Byungjin, Jang, Iloh, Lee, Namhyun, Lee, Seungbae, Hwang, Yuchul, Kim, Hoosung, Pae, Sangwoo
المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-4 Jul, 2022
Relation: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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3مؤتمر
المؤلفون: Le, Hung Khac, van Nguyen, Hoang, Han, Youngbong, Kim, SoYoung
المصدر: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020 IEEE International Symposium on. :578-580 Jul, 2020
Relation: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
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4مؤتمر
المؤلفون: Lee, SeungHyuk, Huynh, Hai Au, Han, YoungBong, Choi, DaeHan, Kim, SoYoung
المصدر: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), 2019 Joint International Symposium on. :266-269 Jun, 2019
Relation: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)
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5مؤتمر
المؤلفون: Han, Youngbong, Lee, SeungHyuk, Huynh, Hai Au, Kim, SoYoung
المصدر: 2019 International Conference on Electronics, Information, and Communication (ICEIC) Electronics, Information, and Communication (ICEIC), 2019 International Conference on. :1-4 Jan, 2019
Relation: 2019 International Conference on Electronics, Information, and Communication (ICEIC)
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6مؤتمر
المؤلفون: Hwang, JongTae, Han, YoungBong, Park, HyunHo, Nah, WanSoo, Kim, SoYoung
المصدر: 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2015 10th International Workshop on the. :147-151 Nov, 2015
Relation: 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
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7مؤتمر
المؤلفون: Han, YoungBong, Huynh, Hai Au, Kim, SoYoung
المصدر: 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) Electromagnetic Compatibility (APEMC), 2017 Asia-Pacific International Symposium on. :244-246 Jun, 2017
Relation: 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
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8مؤتمر
المؤلفون: Han, YoungBong, Huynh, Hai Au, Kim, SoYoung
المصدر: 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Electrical Design of Advanced Packaging and Systems (EDAPS), 2016 IEEE. :123-125 2016
Relation: 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
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9دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
10دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.