المؤلفون: Han-Wen Lin, Meng-Ling Young, Christy Pu, Chung-Ying Huang, Ken-Kuo Lin, Jiahn-Shing Lee, Chiun-Ho Hou

المصدر: Scientific Reports, Vol 13, Iss 1, Pp 1-7 (2023)

مصطلحات موضوعية: Medicine, Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2045-2322

URL الوصول: https://doaj.org/article/f33432b0effa494db0054f132e54e9a9

المؤلفون: Yi-Cheng Chu, Chau-Jie Zhan, Han-Wen Lin, Yu-Wei Huang, Chih Chen

المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :252-255 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)

المؤلفون: Han-wen Lin, Jia-ling Lu, Chen-min Liu, Chih Chen, King-ning Tu, Delphic Chen, Jui-Chao Kuo

المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :90-93 Oct, 2012

Relation: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Shyue-Kung Lu, Chun-Lin Yang, Han-Wen Lin

المصدر: 5th IEEE/ACIS International Conference on Computer and Information Science and 1st IEEE/ACIS International Workshop on Component-Based Software Engineering,Software Architecture and Reuse (ICIS-COMSAR'06) Computer and Information Science, 2006 and 2006 1st IEEE/ACIS International Workshop on Component-Based Software Engineering, Software Architecture and Reuse. ICIS-COMSAR 2006. 5th IEEE/ACIS International Conference on. :355-360 2006

Relation: 5th IEEE/ACIS International Conference on Computer and Information Science and 1st IEEE/ACIS International Workshop on Component-Based Software Engineering,Software Architecture and Reuse

المؤلفون: Shyue-Kung Lu, Chien-Hung Yeh, Han-Wen Lin

المصدر: 10th IEEE Pacific Rim International Symposium on Dependable Computing, 2004. Proceedings. Dependable computing Dependable Computing, 2004. Proceedings. 10th IEEE Pacific Rim International Symposium on. :321-326 2004

Relation: Proceedings. 10th IEEE Pacific Rim International Symposium on Dependable Computing

المؤلفون: Chih Chen, Chien-Min Liu, Tien-Lin Lu, Han-wen Lin, Yi-Cheng Chu, Chia-Ling Lu, Jing-Ye Juang, Kuan-Neng Chen, Tu, K. N.

المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :27-27 May, 2016

Relation: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)

المؤلفون: Han-wen Lin, Chih Chen, Kuo, J.C., Chen, C.C.

المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :166-168 Oct, 2009

Relation: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Xie, Guo-Jun, Liu, Bing-Feng, Wen, Han-Quan, Li, Qi, Yang, Chao-Yong, Han, Wen-Lin, Nan, Jun, Ren, Nan-Qi

المصدر: In International Journal of Hydrogen Energy 27 June 2013 38(19):7780-7788

المؤلفون: Wei-Lan Chiu, Chien-Min Liu, Han-wen Lin, John A. Wu, Y.-C. Chou, K. N. Tu, Chih Chen

المصدر: Scientific Reports, Vol 10, Iss 1, Pp 1-10 (2020)

مصطلحات موضوعية: lcsh:R, lcsh:Medicine, lcsh:Q, lcsh:Science

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doajarticles::c12d49beb6e59487cc824d3a4dbd14ac
http://link.springer.com/article/10.1038/s41598-020-73133-w

المؤلفون: Chien Min Liu, Ya Ching Chou, Chih Chen, John A. Wu, Chiu Wei-Lan, King-Ning Tu, Han-wen Lin

المصدر: Scientific Reports. 10

مصطلحات موضوعية: 010302 applied physics, Multidisciplinary, Fabrication, Materials science, Condensed matter physics, 02 engineering and technology, Direct bonding, Nanoindentation, 021001 nanoscience & nanotechnology, Microstructure, 01 natural sciences, Indentation hardness, Stress (mechanics), 0103 physical sciences, Thin film, 0210 nano-technology, Electroplating

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::75dd59c36e42883313d1b42762e65c14
https://doi.org/10.1038/s41598-020-73133-w