يعرض 1 - 10 نتائج من 474 نتيجة بحث عن '"Haptic guidance"', وقت الاستعلام: 0.90s تنقيح النتائج
  1. 1
    دورية أكاديمية

    المصدر: IEEE Transactions on Neural Systems and Rehabilitation Engineering IEEE Trans. Neural Syst. Rehabil. Eng. Neural Systems and Rehabilitation Engineering, IEEE Transactions on. 32:2545-2552 2024

  2. 2
    مؤتمر

    المصدر: 2023 IEEE World Haptics Conference (WHC) World Haptics Conference (WHC), 2023 IEEE. :266-272 Jul, 2023

    Relation: 2023 IEEE World Haptics Conference (WHC)

  3. 3
    مؤتمر

    المصدر: 2022 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS) Intelligent Robots and Systems (IROS), 2022 IEEE/RSJ International Conference on. :3723-3730 Oct, 2022

    Relation: 2022 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS)

  4. 4
    دورية أكاديمية

    المؤلفون: Wang, Y., Wang, J., Li, Y., Yang, T., Ren, C.

    المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(23):23356-23366 Dec, 2022

  5. 5
    دورية أكاديمية

    المصدر: IEEE Transactions on Haptics IEEE Trans. Haptics Haptics, IEEE Transactions on. 15(2):382-391 Jun, 2022

  6. 6
  7. 7
    دورية أكاديمية

    المؤلفون: Korres, G., Park, W., Eid, M.

    المصدر: IEEE Transactions on Haptics IEEE Trans. Haptics Haptics, IEEE Transactions on. 14(4):825-834 Jan, 2021

  8. 8
    مؤتمر

    المصدر: 2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC) Systems, Man, and Cybernetics (SMC), 2020 IEEE International Conference on. :2284-2290 Oct, 2020

    Relation: 2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC)

  9. 9
    مؤتمر

    المصدر: 2020 Twelfth International Conference on Quality of Multimedia Experience (QoMEX) Quality of Multimedia Experience (QoMEX), 2020 Twelfth International Conference on. :1-6 May, 2020

    Relation: 2020 Twelfth International Conference on Quality of Multimedia Experience (QoMEX)

  10. 10
    دورية أكاديمية

    المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 21(4):5444-5453 Feb, 2021