المؤلفون: Ramya, S, Haran, M V Hari, Ram, G Dinesh, Srinivasan, T K, Vishnuvardhan, G, Pavan, P Sai, Lingaraja, D

المصدر: 2023 International Conference on Computer Communication and Informatics (ICCCI) Computer Communication and Informatics (ICCCI), 2023 International Conference on. :1-5 Jan, 2023

Relation: 2023 International Conference on Computer Communication and Informatics (ICCCI)

المؤلفون: Hafez, W., Agnihotri, P., Asoro, M., Aykol, M., Bains, B., Bambery, R., Bapna, M., Barik, A., Chatterjee, A., Chiu, P.C., Chu, T., Firby, C., Fischer, K., Fradkin, M., Greve, H., Gupta, A., Haralson, E., Haran, M., Hicks, J., Illa, A., Jang, M., Klopcic, S., Kobrinsky, M., Kuns, B., Lai, H.-h., Lanni, G., Lee, S.-H., Lindert, N., Lo, C.-l., Luo, Y., Malyavanatham, G., Marinkovic, B., Maymon, Y., Nabors, M., Neirynck, J., Packan, P., Paliwal, A., Pantisano, L., Paulson, L., Penmatsa, P., Prasad, C., Puls, C., Rahman, T., Ramaswamy, R., Samant, S., Sell, B., Sethi, K., Shah, F., Shamanna, M., Shang, K., Li, Q., Sibakoti, M., Stoeger, J., Strutt, N., Thirugnanasambandam, R., Tsai, C., Wang, X., Wang, A., Wu, S.-j., Xu, Q., Zhong, X.-h., Natarajan, S.

المصدر: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023

Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

المؤلفون: Sell, B., An, S., Armstrong, J., Bahr, D., Bains, B., Bambery, R., Bang, K., Basu, D., Bendapudi, S., Bergstrom, D., Bhandavat, R., Bhowmick, S., Buehler, M., Caselli, D., Cekli, S., Chaganti, Vrsk., Chang, Y. J., Chikkadi, K., Chu, T., Crimmins, T., Darby, G., Ege, C., Elfick, P., Elko-Hansen, T., Fang, S., Gaddam, C., Ghoneim, M., Gomez, H., Govindaraju, S., Guo, Z., Hafez, W., Haran, M., Hattendorf, M., Hu, S., Jain, A., Jaloviar, S., Jang, M., Kameswaran, J., Kapinus, V., Kennedy, A., Klopcic, S., Krishnan, D., Leib, J., Lin, Y.-T., Lindert, N., Liu, G., Loh, O., Luo, Y., Mani, S., Mleczko, M., Mocherla, S., Packan, P., Paik, M., Paliwal, A., Pandey, R., Patankar, K., Pipes, L., Plekhanov, P., Prasad, C., Prince, M., Ramalingam, G., Ramaswamy, R., Riley, J., Perez, J. R. Sanchez, Sandford, J., Sathe, A., Shah, F., Shim, H., Subramanian, S., Tandon, S., Tanniru, M., Thakurta, D., Troeger, T., Wang, X., Ward, C., Welsh, A., Wickramaratne, S., Wnuk, J., Xu, S. Q., Yashar, P., Yaung, J., Yoon, K., Young, N.

المصدر: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2022 IEEE Symposium on. :282-283 Jun, 2022

Relation: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

المؤلفون: Yeoh, A., Madhavan, A., Kybert, N., Anand, S., Shin, J., Asoro, M., Samarajeewa, S., Steigerwald, J., Ganpule, C., Buehler, M., Tripathi, A., Souw, V., Haran, M., Nigam, S., Chikarmane, V., Yashar, P., Mule, T., Wu, Y-H., Lee, K-S., Aykol, M., Marla, K., Sinha, P., Kirby, S., Hiramatsu, H., Han, W., Mori, M., Sharma, M., Jeedigunta, H., Sprinkle, M., Pelto, C., Tanniru, M., Leatherman, G., Fischer, K., Post, I., Auth, C.

المصدر: 2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :144-147 Jun, 2018

Relation: 2018 IEEE International Interconnect Technology Conference (IITC)

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المؤلفون: Fischer, K., Agostinelli, M., Allen, C., Bahr, D., Bost, M., Charvat, P., Chikarmane, V., Fu, Q., Ganpule, C., Haran, M., Heckscher, M., Hiramatsu, H., Hwang, E., Jain, P., Jin, I., Kasim, R., Kosaraju, S., Lee, K. S., Liu, H., McFadden, R., Nigam, S., Patel, R., Pelto, C., Plekhanov, P., Prince, M., Puls, C., Rajamani, S., Rao, D., Reese, P., Rosenbaum, A., Sivakumar, S., Song, B., Uncuer, M., Williams, S., Yang, M., Yashar, P., Natarajan, S.

المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :5-8 May, 2015

Relation: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

المؤلفون: Auth, C., Aliyarukunju, A., Asoro, M., Bergstrom, D., Bhagwat, V., Birdsall, J., Bisnik, N., Buehler, M., Chikarmane, V., Ding, G., Fu, Q., Gomez, H., Han, W., Hanken, D., Haran, M., Hattendorf, M., Heussner, R., Hiramatsu, H., Ho, B., Jaloviar, S., Jin, I., Joshi, S., Kirby, S., Kosaraju, S., Kothari, H., Leatherman, G., Lee, K., Leib, J., Madhavan, A., Marla, K., Meyer, H., Mule, T., Parker, C., Parthasarathy, S., Pelto, C., Pipes, L., Post, I., Prince, M., Rahman, A., Rajamani, S., Saha, A., Santos, J. Dacuna, Sharma, M., Sharma, V., Shin, J., Sinha, P., Smith, P., Sprinkle, M., Amour, A. St., Staus, C., Suri, R., Towner, D., Tripathi, A., Tura, A., Ward, C., Yeoh, A.

المصدر: 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :29.1.1-29.1.4 Dec, 2017

Relation: 2017 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Natarajan, S., Agostinelli, M., Akbar, S., Bost, M., Bowonder, A., Chikarmane, V., Chouksey, S., Dasgupta, A., Fischer, K., Fu, Q., Ghani, T., Giles, M., Govindaraju, S., Grover, R., Han, W., Hanken, D., Haralson, E., Haran, M., Heckscher, M., Heussner, R., Jain, P., James, R., Jhaveri, R., Jin, I., Kam, H., Karl, E., Kenyon, C., Liu, M., Luo, Y., Mehandru, R., Morarka, S., Neiberg, L., Packan, P., Paliwal, A., Parker, C., Patel, P., Patel, R., Pelto, C., Pipes, L., Plekhanov, P., Prince, M., Rajamani, S., Sandford, J., Sell, B., Sivakumar, S., Smith, P., Song, B., Tone, K., Troeger, T., Wiedemer, J., Yang, M., Zhang, K.

المصدر: 2014 IEEE International Electron Devices Meeting Electron Devices Meeting (IEDM), 2014 IEEE International. :3.7.1-3.7.3 Dec, 2014

Relation: 2014 IEEE International Electron Devices Meeting (IEDM)

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المؤلفون: Marom, A, Barak, A F, Kramer, M P, Lewinsky, H, Binsky-Ehrenreich, I, Cohen, S, Tsitsou-Kampeli, A, Kalchenko, V, Kuznetsov, Y, Mirkin, V, Dezorella, N, Shapiro, M, Schwartzberg, P L, Cohen, Y, Shvidel, L, Haran, M, Becker-Herman, S, Herishanu, Y, Shachar, I^{Aff1, IDonc2016238_cor19}

المصدر: Oncogene. 36(5):628-638