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1دورية أكاديمية
المؤلفون: Shafiei Dizaji, M.Aff1, IDs40799021004799_cor1, Alipour, M., Harris, D.K.
المصدر: Experimental Techniques. 46(2):257-272
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2مؤتمر
المؤلفون: Roy, C.K., Bhavnani, S., Hamilton, M., Johnson, W.R., Knight, R.W., Harris, D.K.
المصدر: 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st. :235-239 Mar, 2015
Relation: 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
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3دورية أكاديمية
المؤلفون: Dizaji, M.S., Alipour, M., Harris, D.K.
المصدر: In Engineering Structures 1 March 2021 230
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4مؤتمر
المؤلفون: Renzhe Zhao, Yun Zhang, Johnson, R.W., Harris, D.K.
المصدر: 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Electronic components and technology Electronic Components and Technology Conference, 2001. Proceedings., 51st. :699-703 2001
Relation: 51st Electronic Components and Technology Conference 2001. Proceedings
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5مؤتمر
المؤلفون: Harris, D.K., Goldschmidt, V.W., Warren, D.G.
المصدر: IECEC 96. Proceedings of the 31st Intersociety Energy Conversion Engineering Conference Energy conversion engineering Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety. 3:1987-1992 vol.3 1996
Relation: IECEC 96. Proceedings of the 31st Intersociety Energy Conversion Engineering Conference
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6دورية أكاديمية
المؤلفون: Yun Zhang, Renzhe Zhao, Harris, D.K., Johnson, R.W.
المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 25(4):308-317 Oct, 2002
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7مؤتمر
المؤلفون: Odhekar, D.D., Harris, D.K.
المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :8 pp.-577 2006
Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems
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8دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
9دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
10
المؤلفون: Lantsoght, E.O.L., Bonifaz, J., Sanchez, T.A., Harris, D.K., Lantsoght, Eva
المصدر: Load Testing of Bridges: Current Practice and Diagnostic Load Testing, 12
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