المؤلفون: Ikeda Yuya, Koike Yuto, Shinya Ryoji, Hasegawa Koichi

المصدر: Journal of Nematology, Vol 56, Iss 1, Pp 994-1003 (2024)

مصطلحات موضوعية: insect-nematode interaction, distribution, viviparity, dung beetle, ecology, Biology (General), QH301-705.5

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2640-396X

URL الوصول: https://doaj.org/article/3ff66f42d4cd4d21b328499d794ecabb

المؤلفون: Kumar, Lakshmi Narasimha Vijay, Moon, Kyoung-Sik, Swaminathan, Madhavan, Kanno, Kimiyuki, Ito, Hirokazu, Ogawa, Taku, Hasegawa, Koichi

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2281-2286 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Kanno, Kimiyuki, Ito, Hirokazu, Ogawa, Taku, Tatara, Ryoji, Hasegawa, Koichi, Watanabe, Atom, Kumar, Lakshmi Narasimha Vijay, Swaminathan, Madhavan

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :544-549 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Nemoto, Tetsuya, Ooto, Junichi, Ito, Hirokazu, Hasegawa, Koichi

المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :119-120 May, 2022

Relation: 2022 International Conference on Electronics Packaging (ICEP)

المؤلفون: Morimoto, Tetsuya, Katoh, Hisaya, Ishida, Yuichi, Hara, Eiichi, Kusano, Masahiro, Naito, Kimiyoshi, Watanabe, Makoto, Takagi, Kiyoka, Arai, Keiji, Hasegawa, Koichi

المصدر: In Engineering Fracture Mechanics 22 August 2024 307

المؤلفون: Hokazono, Yuki, Hasegawa, Koichi, Narusue, Yoshiaki, Morikawa, Hiroyuki

المصدر: ICC 2019 - 2019 IEEE International Conference on Communications (ICC) Communications (ICC), ICC 2019 - 2019 IEEE International Conference on. :1-7 May, 2019

Relation: ICC 2019 - 2019 IEEE International Conference on Communications (ICC)

المؤلفون: Mizuno, Hikaru, Ishii, Hiroyuki, Kato, Hitoshi, Mori, Takashi, Ishikawa, Hiroki, Maruyama, Yooichiroh, Ohkita, Kenzo, Hasegawa, Koichi

المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :252-256 Apr, 2018

Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Li, Rui, Matsumoto, Tomoyuki, Taniguchi, Takuhiro, Nishiguchi, Naoki, Hiro, Akito, Sakakibara, Hirokazu, Hasegawa, Koichi

المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :42-45 Apr, 2018

Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Katsurayama, Makoto, Ito, Hirokazu, Akimaru, Hisanori, Matsumoto, Tomoyuki, Sakakibara, Hirokazu, Okamoto, Kenji, Hasegawa, Koichi

المصدر: 2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :152-155 Apr, 2017

Relation: 2017 International Conference on Electronics Packaging (ICEP)

المؤلفون: Hasegawa, Koichi, Mori, Takashi, Mizuno, Hikaru, Ishii, Hiroyuki, Maruyama, Yooichiroh, Ohkita, Kenzo

المصدر: 2017 Pan Pacific Microelectronics Symposium (Pan Pacific) Microelectronics Symposium (Pan Pacific), 2017 Pan Pacific. :1-7 Feb, 2017

Relation: 2017 Pan Pacific Microelectronics Symposium (Pan Pacific)