يعرض 1 - 10 نتائج من 138 نتيجة بحث عن '"He, Y.T."', وقت الاستعلام: 0.99s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Electron tomography for sintered ceramic materials by a neural network algebraic reconstruction technique

    المؤلفون: Shen, R.H., He, Y.T., Ming, W.Q., Zhang, Y., Xu, X.D., Chen, J.H.

    المصدر: In Journal of Materials Science & Technology 20 February 2022 100:75-81

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  2. 2
    مؤتمر
    Effects of aeronautical conditions on passivation cracking of micro-structures of IC packages

    المؤلفون: He, Y.T., Li, H.P., Li, F., Wang, L., Zhang, G.Q., Ernst, L.J.

    المصدر: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on. :1-4 2006

    Relation: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

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  3. 3
    دورية أكاديمية
    Dynamic response analysis of story-adding structure with isolation technique subjected to near-fault pulse-like ground motions

    المؤلفون: Ma, X.T., Bao, C., Doh, S.I., Lu, H., Zhang, L.X., Ma, Z.W., He, Y.T.

    المصدر: In Physics and Chemistry of the Earth February 2021 121

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  4. 4
    مؤتمر
    Cracking prediction of IC's passivation layer using J-integral

    المؤلفون: He, Y.T., Zhang, G.Q., van Drie, W.D., Fan, X.J., Ernst, L.J.

    المصدر: Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Electronic packaging technology Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on. :362-367 2003

    Relation: ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings

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  5. 5
    مؤتمر
    The influence of leadframe on passivation cracks growth

    المؤلفون: He, Y.T., Zhang, G.Q., van Driel, W.D., Fan, X.J., Ernst, L.J.

    المصدر: Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Electronic packaging technology Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on. :430-437 2003

    Relation: ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings

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  6. 6
    دورية أكاديمية
    Feasible atomic-resolution electron tomography for general crystal surfaces by quantitative reconstruction from a high-resolution image

    المؤلفون: Shen, R.H., Ming, W.Q., Chen, J.H., He, Y.T., Mi, S.B., Ma, C.S.

    المصدر: In Ultramicroscopy October 2019 205:27-38

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  7. 7
    مؤتمر
    Passivation Cracking Analyses of ICs for Different Fixing Position under the Aeronautical Working Conditions

    المؤلفون: He, Y.T., Li, H.P., Li, F., Shi, R., Zhang, G.Q., Ernst, L.J.

    المصدر: 2006 7th International Conference on Electronic Packaging Technology Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on. :1-5 Aug, 2006

    Relation: 2006 7th International Conference on Electronic Packaging Technology

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  8. 8
    دورية أكاديمية
    Long-term fertilization increases soil organic carbon and alters its chemical composition in three wheat-maize cropping sites across central and south China

    المؤلفون: He, Y.T., He, X.H., Xu, M.G., Zhang, W.J., Yang, X.Y., Huang, S.M.

    المصدر: In Soil & Tillage Research April 2018 177:79-87

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  9. 9
    دورية أكاديمية
    Warm white light generation from single phase Sr3Y(PO4)3:Dy3+, Eu3+ phosphors with near ultraviolet excitation

    المؤلفون: Huang, B.Y., Feng, B.L., Luo, L., Han, C.L., He, Y.T., Qiu, Z.R.

    المصدر: In Materials Science & Engineering B October 2016 212:71-77

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  10. 10
    دورية أكاديمية
    Prediction of crack growth in IC passivation layers

    المؤلفون: He, Y.T., van Gils, M.A.J., van Driel, W.D., Zhang, G.Q., van Silfhout, R.B.R., Ernst, L.J.

    المصدر: In Microelectronics Reliability 2004 44(12):2003-2009

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