المؤلفون: Han, Jun, He, ZhiDan

المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-6 Jul, 2022

Relation: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Wang, Suming, He, Zhidan, Chen, Wenyuan, Ji, Honghu

المصدر: 2022 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2022 China. :1-4 Jun, 2022

Relation: 2022 China Semiconductor Technology International Conference (CSTIC)

المؤلفون: Zou Zhao Yi, Guotong Du, Liu Shaolin, He Zhidan, Sun Yanfeng, Weifeng Liu

المصدر: Vacuum. 80:981-985

مصطلحات موضوعية: Materials science, Morphology (linguistics), Scanning electron microscope, Analytical chemistry, Substrate (electronics), Sputter deposition, Condensed Matter Physics, Surfaces, Coatings and Films, Electrical resistivity and conductivity, visual_art, visual_art.visual_art_medium, Crystallite, Ceramic, Thin film, Instrumentation

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e87f0f64ce0b19fc0c10be4d633eb0da
https://doi.org/10.1016/j.vacuum.2005.12.011