يعرض 1 - 10 نتائج من 9,691 نتيجة بحث عن '"Heat Sinks"', وقت الاستعلام: 1.00s تنقيح النتائج
  1. 1
    مؤتمر
    Optimization of Pin Fin Structure for Uniform Temperature Distribution in Multi-Chip Parallel-Connected Power Modules

    المؤلفون: Zhang, Xiao, Ma, Kun, Liu, Xun, Huang, Wei, Liu, Sheng, Zhou, Yang

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  2. 2
    مؤتمر
    Investigation of Embedded Microchannel Heat Transfer Performance Based on High Power Integrated Chip

    المؤلفون: He, Wei, Li, Jiaqi, Li, Qiang

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  3. 3
    مؤتمر
    Comparative Analysis of Micro/Minichannel Flow Boiling Pattern Recognition and Classification using a Combined CNN-Clustering Algorithms Approach

    المؤلفون: Harris, Mohammad, Angelopoulou, Anastasia, Wu, Hongwei, Zhang, Wenbin

    المصدر: 2024 14th International Conference on Pattern Recognition Systems (ICPRS) Pattern Recognition Systems (ICPRS), 2024 14th International Conference on. :1-9 Jul, 2024

    Relation: 2024 14th International Conference on Pattern Recognition Systems (ICPRS)

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  4. 4
    مؤتمر
    Research on Single Tube Packaging Technology for High-Power Blue Semiconductor Lasers

    المؤلفون: Gao, Xiang, Yang, Wenxin, Tao, Chunyan, Hao, Mingming

    المصدر: 2024 22nd International Conference on Optical Communications and Networks (ICOCN) Optical Communications and Networks (ICOCN), 2024 22nd International Conference on. :1-3 Jul, 2024

    Relation: 2024 22nd International Conference on Optical Communications and Networks (ICOCN)

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  5. 5
    دورية أكاديمية
    Enhanced Thermal and Mechanical Performance in Insulated Aramid/Functionalized Graphene Composite

    المؤلفون: Fan, X., Zhang, W., Wang, H., Li, C., Yu, X., Fan, S., Lv, F.

    المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 31(4):1805-1814 Aug, 2024

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  6. 6
    دورية أكاديمية
    Identification of Microchannel Flow Boiling Regimes With Pt Thin-Film Impedance Sensors

    المؤلفون: Schepperle, M., Woias, P.

    المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(14):22843-22854 Jul, 2024

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  7. 7
    مؤتمر
    Tailoring Metaheuristics for Designing Thermodynamic-Optimal Cooling Devices for Microelectronic Thermal Management Applications

    المؤلفون: Perez-Espinosa, Guillermo, Cruz-Duarte, Jorge M., Amaya, Ivan, Ortiz-Bayliss, Jose C., Terashima-Marin, Hugo, Pillay, Nelishia

    المصدر: 2024 IEEE Congress on Evolutionary Computation (CEC) Evolutionary Computation (CEC), 2024 IEEE Congress on. :1-8 Jun, 2024

    Relation: 2024 IEEE Congress on Evolutionary Computation (CEC)

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  8. 8
    مؤتمر
    Numerical Study on the Non-Uniformity of Secondary Flow Distribution in Minichannels

    المؤلفون: Tang, Jie, Huang, Zhidu, Wang, Le, Luo, Bing, Zhong, Zheng, Li, Bin, Zhang, Haofeng

    المصدر: 2024 6th International Conference on Energy Systems and Electrical Power (ICESEP) Energy Systems and Electrical Power (ICESEP), 2024 6th International Conference on. :70-76 Jun, 2024

    Relation: 2024 6th International Conference on Energy Systems and Electrical Power (ICESEP)

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  9. 9
    مؤتمر
    A Comparative Study on Saturated Boiling Heat Transfer Characteristics in Heat Sinks with Different Rib Shapes

    المؤلفون: Tang, Jie, Huang, Zhidu, Wang, Le, Zhong, Zheng, Liu, Lei, Yongsheng, X., Pan, Ruijian

    المصدر: 2024 6th International Conference on Energy Systems and Electrical Power (ICESEP) Energy Systems and Electrical Power (ICESEP), 2024 6th International Conference on. :1440-1445 Jun, 2024

    Relation: 2024 6th International Conference on Energy Systems and Electrical Power (ICESEP)

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  10. 10
    مؤتمر
    A General Approach for Maximizing Heat Transfer and Minimizing Capacitance Between MOSFET Configuration and Heat Sink with Thermal Pads

    المؤلفون: Drillings, Benjamin G., Jahnes, Matthew, Preindl, Matthias

    المصدر: 2024 IEEE Transportation Electrification Conference and Expo (ITEC) Transportation Electrification Conference and Expo (ITEC), 2024 IEEE. :1-5 Jun, 2024

    Relation: 2024 IEEE Transportation Electrification Conference and Expo (ITEC)

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