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1دورية أكاديمية
المؤلفون: Yongjie Ren, Heda Bai, Xincheng Liu, Jin Li, Xiangli Liu
المصدر: Materials, Vol 17, Iss 10, p 2311 (2024)
مصطلحات موضوعية: Cu film, HiPIMS, plasma, duty cycle, grain size, electrical resistivity, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Xincheng Liu, Heda Bai, Yongjie Ren, Jin Li, Xiangli Liu
المصدر: Materials, Vol 17, Iss 10, p 2342 (2024)
مصطلحات موضوعية: Cu film, HiPIMS, magnetron sputtering, plasma, pulse width, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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3دورية أكاديمية
المؤلفون: Heda Bai, Jin Li, Jialai Gao, Jinyang Ni, Yaxiong Bai, Jie Jian, Lin Zhao, Bowen Bai, Zeyun Cai, Jianchao He, Hongsheng Chen, Xuesong Leng, Xiangli Liu
المصدر: Materials, Vol 16, Iss 18, p 6303 (2023)
مصطلحات موضوعية: CrN, coatings, high power impulse magnetron sputtering, direct current magnetron sputtering, microstructure, mechanical, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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4
المصدر: IOP Conference Series: Materials Science and Engineering. 612:032135
مصطلحات موضوعية: Materials science, Abrasive, Metallurgy, Humidity, Wear testing
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5دورية أكاديمية
المصدر: IOP Conference Series: Materials Science & Engineering; Oct2019, Vol. 612 Issue 3, p1-1, 1p