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1دورية أكاديميةElectrochemical Deposition of CoP and CoNiP as Hard Magnetic Scales in a Position Measurement System
المؤلفون: Martin Theis, Tobias Bill, Heiko Knoll, Peter Starke, Monika Saumer
المصدر: Metals, Vol 12, Iss 2, p 235 (2022)
مصطلحات موضوعية: process–material correlations, thick hard magnets, electrochemical deposition, integrated process, MEMS, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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المؤلفون: Franz-Josef Braun, Monika Saumer, Martin Theis, Kai Zoschke, Peter Frank, Hermann Oppermann, Fabian Klose, Andreas Lenkl, Heiko Knoll, Johannes Paul
المصدر: 2018 International Wafer Level Packaging Conference (IWLPC).
مصطلحات موضوعية: Resistive touchscreen, Wire bonding, Materials science, Through-silicon via, Bar (music), business.industry, Interposer, Optoelectronics, business, Die (integrated circuit), Flip chip, Position sensor
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4f786cf746f7cbe94745f99cc2302de6
https://doi.org/10.23919/iwlpc.2018.8573270 -
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المؤلفون: Heiko Knoll, Martin Theis, Andreas Lenkl, Kai Zoschke, Peter Frank, Hermann Oppermann, Johannes Paul, Fabian Klose, Monika Saumer, Franz-Josef Braun
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Interconnection, Wire bonding, Materials science, Through-silicon via, business.industry, 010401 analytical chemistry, Electrical engineering, 02 engineering and technology, 021001 nanoscience & nanotechnology, Chip, 01 natural sciences, 0104 chemical sciences, Magnetic field, Position (vector), Miniaturization, 0210 nano-technology, business, Position sensor
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::311acb600b096a89fc472e90e9d330a0
https://doi.org/10.1109/ectc.2018.00141 -
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المؤلفون: Heiko Knoll, Rolf Slatter, Matthias Brusius
المصدر: 2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe).
مصطلحات موضوعية: Electric machine, business.product_category, Computer science, business.industry, Dynamic range, 020208 electrical & electronic engineering, Bandwidth (signal processing), Electrical engineering, 02 engineering and technology, Magnet, 0202 electrical engineering, electronic engineering, information engineering, Miniaturization, Oversampling, 020201 artificial intelligence & image processing, business, Electrical conductor, Diode
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::795aa0a50cc6d5d63307c844ac1b9a97
https://doi.org/10.1109/epe.2016.7695648 -
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المؤلفون: Christophe Poizat, Heiko Knoll, Winfried Schmitt, Markus Grimm, Renate Freudenberger, Heidi Fauser
المصدر: Materials Science Forum. :53-58
مصطلحات موضوعية: Materials science, Mechanical Engineering, Metallurgy, Tribology, Condensed Matter Physics, Durability, Corrosion, Mechanics of Materials, Cavitation, Ultimate tensile strength, General Materials Science, Ductility, Layer (electronics), Elastic modulus
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::806e9f424494b4873565a7c1ce06d2d9
https://doi.org/10.4028/www.scientific.net/msf.492-493.53 -
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المؤلفون: Tilo Poller, Heiko Knoll, Josef Lutz, Bianca Bottge
المصدر: 2013 15th European Conference on Power Electronics and Applications (EPE).
مصطلحات موضوعية: Materials science, chemistry, Aluminium, Power cycling, Electronic engineering, chemistry.chemical_element, Surface finish, Temperature cycling, Composite material, Copper, Layer (electronics), Finite element method
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cb380768e97be5ae3f569b3884b3d94c
https://doi.org/10.1109/epe.2013.6634442 -
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المؤلفون: Matthias Petzold, Werner Weidenauer, Sandy Bennemann, Sebastian Brand, Peter Ingram, Heiko Knoll
المصدر: 3rd Electronics System Integration Technology Conference ESTC.
مصطلحات موضوعية: Materials science, Analytical chemistry, Hardware_PERFORMANCEANDRELIABILITY, Temperature cycling, Engineering physics, Reliability (semiconductor), Thermal conductivity, visual_art, Power electronics, Hardware_INTEGRATEDCIRCUITS, visual_art.visual_art_medium, Electronics, Ceramic, Material properties, Voltage
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c2a954a0c424dc082b9b938273fd8822
https://doi.org/10.1109/estc.2010.5642985 -
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المؤلفون: Heiko Knoll
المصدر: Probleme der Dialektik heute ISBN: 9783531170626
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8488abd22387f9f31c875e838f4764d1
https://doi.org/10.1007/978-3-531-91880-8_1 -
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المؤلفون: Ralf B. Wehrspohn, Kathrin Schwirn, Heiko Knoll, Andreas Greiner, Paul T. Miclea, Petra Göring, Ulrich Gösele, Silko Grimm, Joachim H. Wendorff, Martin Steinhart
المصدر: Small (Weinheim an der Bergstrasse, Germany). 3(6)
مصطلحات موضوعية: chemistry.chemical_classification, business.product_category, Nanostructure, Fabrication, Materials science, Capillary action, Nanotechnology, General Chemistry, Polymer, Silicon Dioxide, Nanostructures, Biomaterials, Template, chemistry, Etching (microfabrication), Microfiber, Microscopy, Electron, Scanning, Polystyrenes, General Materials Science, Polyvinyls, business, Porosity, Biotechnology
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المؤلفون: Matthias Petzold, Lutz Schrapler, Tobias Muller, Heiko Knoll, Frank Altmann
المصدر: 2006 1st Electronic Systemintegration Technology Conference.
مصطلحات موضوعية: Wire bonding, Materials science, Kirkendall effect, Transmission electron microscopy, Scanning electron microscope, Metallurgy, Intermetallic, Tape-automated bonding, Focused ion beam, Corrosion
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::edff8840d4f2dacd782186a083813b4a
https://doi.org/10.1109/estc.2006.280174