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المؤلفون: Carles Bosch, Joerg Lindenau, Alexandra Pacureanu, Christopher J. Peddie, Marta Majkut, Andrew C. Douglas, Raffaella Carzaniga, Alexander Rack, Lucy Collinson, Andreas T. Schaefer, Heiko Stegmann
مصطلحات موضوعية: Physics and Astronomy (miscellaneous), Ecology,Evolution & Ethology, FOS: Clinical medicine, Neurosciences, Microfabrication & Bioengineering, Imaging, Computational & Systems Biology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8743dbd5e2211754851a9ea990788138
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المؤلفون: Domenico, Mello, Giuseppe, Sciuto, Massimiliano, Astuto, Francesca Santangelo, M., Heiko, Stegmann, Cognigni, Flavio, Rossi, Marco
المصدر: International Symposium for Testing and Failure Analysis.
مصطلحات موضوعية: focused ion beam, automotive applications, microcontroller, failure analysis, fault isolation, scanning electron microscopy
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::df1b00c2fae4b4ef81d7455ea3b6a5c3
https://doi.org/10.31399/asm.cp.istfa2022p0201 -
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المؤلفون: Heiko Stegmann, Hubert Schulz, James Whitby
المصدر: International Symposium for Testing and Failure Analysis.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cb2b4e6ff6bd5d0c1fe5927b16d97901
https://doi.org/10.31399/asm.cp.istfa2022p0257 -
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المؤلفون: Heiko Stegmann
المصدر: International Symposium for Testing and Failure Analysis.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::00ecc8dc1ed46155fb07688f2d29b093
https://doi.org/10.31399/asm.cp.istfa2022tpk1 -
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المؤلفون: Gregory M. Johnson, Heiko Stegmann, Andreas Rummel
المصدر: International Symposium for Testing and Failure Analysis.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5687c4f0cec6aafc63dce4156abfc45b
https://doi.org/10.31399/asm.cp.istfa2022p0262 -
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المؤلفون: Allen Gu, Masako Terada, Heiko Stegmann, Thomas Rodgers, Chao Fu, Yanjing Yang
المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6bde57c69985af5ad4840068fdfb5b2f
https://doi.org/10.1109/ipfa55383.2022.9915756 -
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المؤلفون: Greg Johnson, Thomas Rodgers, Heiko Stegmann, Frank Hitzel
المصدر: 2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::06436340f25862fed9451c591af5b1a1
https://doi.org/10.1109/asmc54647.2022.9792505 -
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المؤلفون: Heiko Stegmann
المصدر: International Symposium for Testing and Failure Analysis.
مصطلحات موضوعية: Materials science, Scanning electron microscope, business.industry, Optoelectronics, Current (fluid), business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7797215bd206304cdad4e44762997cae
https://doi.org/10.31399/asm.cp.istfa2021tpk1 -
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المؤلفون: Heiko Stegmann, Hans-Jürgen Engelmann, Yvonne Ritz, Ehrenfried Zschech
المصدر: Practical Metallography. 41:180-189
مصطلحات موضوعية: Semiconductor industry, Materials science, Mechanics of Materials, Transmission electron microscopy, business.industry, Metals and Alloys, Microelectronics, Sample preparation, Nanotechnology, Condensed Matter Physics, business, Focused ion beam, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bda09f5ac68cde94edda9ac3200152a5
https://doi.org/10.1515/pm-2004-410406 -
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المؤلفون: H.-J. Engelmann, Y. Ritz, B. Volkmann, E. Zschech, Q. de Robiliard, Heiko Stegmann, Holger Saage
المصدر: Microscopy Today. 11:22-25
مصطلحات موضوعية: Sample handling, Materials science, General Computer Science, Ion beam, business.industry, Scanning electron microscope, Sample (graphics), Focused ion beam, Ion, 03 medical and health sciences, 0302 clinical medicine, 030220 oncology & carcinogenesis, Cathode ray, Optoelectronics, Sample preparation, 030223 otorhinolaryngology, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a9b7d01dabcf3b13639bc324ae810ac4
https://doi.org/10.1017/s1551929500052457