يعرض 1 - 10 نتائج من 81 نتيجة بحث عن '"Heinig, Andy"', وقت الاستعلام: 0.80s تنقيح النتائج
  1. 1
    مؤتمر
    BoW Standard-Based Receiver Architecture: Design, Analysis, and Implementation

    المؤلفون: Navilipuri, Lavakumar, Kadam, Sneha, Heinig, Andy

    المصدر: 2024 4th Interdisciplinary Conference on Electrics and Computer (INTCEC) Electrics and Computer (INTCEC), 2024 4th Interdisciplinary Conference on. :1-4 Jun, 2024

    Relation: 2024 4th Interdisciplinary Conference on Electrics and Computer (INTCEC)

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  2. 2
    مؤتمر
    BoW Die to Die interface implementation: An open standardized interface for future Electronics

    المؤلفون: Ahmed, Maudood, Heinig, Andy, Kadam, Sneha, Navilipuri, Lavakumar

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :792-796 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  3. 3
    مؤتمر
    Advanced Packaging Using Chiplets and Standardized Physical Interfaces

    المؤلفون: Hopsch, Fabian, Ahmed, Maudood, Heinig, Andy

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :7-10 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  4. 4
    مؤتمر
    In-Package Ring Hybrid Coupler With On-chip Termination

    المؤلفون: Trieb, Robert, Heinig, Andy

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :271-275 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Bunch of Wires Interface PHY Design for Multi-Chiplet Systems

    المؤلفون: Ahmed, Maudood, Chaudhary, Muhammad Waqas, Heinig, Andy

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :395-398 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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  6. 6
    مؤتمر
    A Generic Approach for Automatic Design Rule Derivation for Assembly Design Kits (ADK)

    المؤلفون: Heinig, Andy, Hopsch, Fabian

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :392-394 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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  7. 7
    مؤتمر
    Interconnect Aware Power Optimization of Low Swing Driver for Multi-Chip Interfaces

    المؤلفون: Chaudhary, Muhammad Waqas, Heinig, Andy, Choubey, Bhaskar

    المصدر: 2020 27th IEEE International Conference on Electronics, Circuits and Systems (ICECS) Electronics, Circuits and Systems (ICECS), 2020 27th IEEE International Conference on. :1-4 Nov, 2020

    Relation: 2020 27th IEEE International Conference on Electronics, Circuits and Systems (ICECS)

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  8. 8
    مؤتمر
    Construction of Rf-Blocks in Package Technologies

    المؤلفون: Hopsch, Fabian, Trieb, Robert, Heinig, Andy

    المصدر: 2020 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2020 International. :1-6 Oct, 2020

    Relation: 2020 International Wafer Level Packaging Conference (IWLPC)

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  9. 9
    مؤتمر
    13-Gb/s Transmitter for Bunch of Wires Chip-to-Chip Interface Standard

    المؤلفون: Chaudhary, Muhammad Waqas, Heinig, Andy, Choubey, Bhaskar

    المصدر: 2020 IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2020 IEEE 63rd International Midwest Symposium on. :333-336 Aug, 2020

    Relation: 2020 IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS)

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  10. 10
    مؤتمر
    Low-Cost Chip2Chip Integration for Partitioning Processing and Memory

    المؤلفون: Hopsch, Fabian, Heinig, Andy

    المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :511-514 Dec, 2019

    Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

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