المؤلفون: Jyothsna Murli Rao, Abhijeet Yadav, Helene Conseil-Gudla, Rajan Ambat

المصدر: Frontiers in Materials, Vol 9 (2022)

مصطلحات موضوعية: corrosion, electronics, humidity, KOH electrolyte, zinc air battery, Technology

وصف الملف: electronic resource

Relation: https://www.frontiersin.org/articles/10.3389/fmats.2022.1000808/full; https://doaj.org/toc/2296-8016

URL الوصول: https://doaj.org/article/530ffb1933344925b511ca5cfdde5b86

المؤلفون: İlknur Baylakoğlu, Aleksandra Fortier, San Kyeong, Rajan Ambat, Helene Conseil-Gudla, Michael H. Azarian, Michael G. Pecht

المصدر: e-Prime: Advances in Electrical Engineering, Electronics and Energy, Vol 1, Iss , Pp 100016- (2021)

مصطلحات موضوعية: Electronics, Electronic packaging, Effects of water, Exposure of electronics to underwater environments, Humidity, Moisture, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2772671121000152; https://doaj.org/toc/2772-6711

URL الوصول: https://doaj.org/article/4419905e24cc49918300bd6f257a6828

المؤلفون: Peng Xue, Amir Sajjad Bahman, Francesco Iannuzzo, Helene Conseil Gudla, Anish Rao Lakkaraju, Rajan Ambat

المصدر: Xue, P, Bahman, A S, Iannuzzo, F, Gudla, H C, Lakkaraju, A R & Ambat, R 2022, ' Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study ', Microelectronics Reliability, vol. 139, 114796 . https://doi.org/10.1016/j.microrel.2022.114796

مصطلحات موضوعية: Printed circuit boards, Electrochemical migration, Humidity, Numerical simulation, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9eb58182fb4ebbbb9c091f14fc4e9a31
https://vbn.aau.dk/da/publications/75e2e10c-bccb-4316-83b7-97f44881aa80

المؤلفون: Morten Stendahl Jellesen, Rajan Ambat, Helene Conseil-Gudla

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:324-332

مصطلحات موضوعية: 010302 applied physics, Desiccant, Absorption (acoustics), Absorption of water, Moisture, business.industry, 020209 energy, Electronic packaging, Humidity, 02 engineering and technology, Heat sink, 01 natural sciences, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Environmental science, Electronics, Electrical and Electronic Engineering, Process engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5b28c89ac37e023ec47fd9710556bdb5
https://doi.org/10.1109/tcpmt.2020.3045495

المؤلفون: Helene Conseil-Gudla, Max Spooner, Murat Kulahci, Rajan Ambat

المصدر: Microelectronics Reliability. 136:114655

مصطلحات موضوعية: Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1b0b0b88190d0fa9a4d25385158c78a2
https://doi.org/10.1016/j.microrel.2022.114655

المؤلفون: Rajan Ambat, Helene Conseil-Gudla, Mathias Hain, Lutz Müller, Gerald Hamm

المصدر: Conseil-Gudla, H, Hamm, G, Mueller, L, Hain, M & Ambat, R 2018, ' Experimental Study of Moisture Ingress in First and Second Levels of Electronic Housings ', I E E E Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 11, pp. 1928-1937 . https://doi.org/10.1109/TCPMT.2018.2799233

مصطلحات موضوعية: Materials science, Electronic packaging, 02 engineering and technology, Molding (process), 01 natural sciences, Temperature measurement, Industrial and Manufacturing Engineering, Printed circuit board, chemistry.chemical_compound, 0103 physical sciences, Housings, Relative humidity, Moisture diffusion, Electrical and Electronic Engineering, Composite material, 010302 applied physics, Moisture, Epoxy molding compound (EMC), Temperature, Humidity, 021001 nanoscience & nanotechnology, Electronic, Optical and Magnetic Materials, Printed circuit board (PCB), Polybutylene terephthalate, chemistry, 0210 nano-technology

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f676298dee4dd28576b588eaccd79400
https://doi.org/10.1109/tcpmt.2018.2799233

المؤلفون: Rajan Ambat, Helene Conseil-Gudla, Feng Li

المصدر: Conseil-Gudla, H, Li, F & Ambat, R 2021, ' Reflow Residues on Printed Circuit Board Assemblies and Interaction with Humidity ', IEEE Transactions on Device and Materials Reliability, vol. 21, no. 4, pp. 594-602 . https://doi.org/10.1109/TDMR.2021.3120941

مصطلحات موضوعية: Conductivity, Absorption of water, Materials science, Humidity, food and beverages, Reflow, Trapped residues, Electronic, Optical and Magnetic Materials, Printed circuit board, Standoff height, Water absorption, Board, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, Components

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e02985371a1c95435d8c86628a9f535d
https://orbit.dtu.dk/en/publications/cc32000e-b31b-4117-bf26-db71813f793d

المؤلفون: Helene Conseil-Gudla, Michael H. Azarian, Ilknur Baylakoğlu, Michael Pecht, Aleksandra Fortier, Rajan Ambat, San Kyeong

المصدر: Baylakoğlu, İ, Fortier, A, Kyeong, S, Ambat, R, Gudla, H C, H. Azarian, M & G. Pecht, M 2021, ' The detrimental effects of water on electronic devices ', e-Prime-Advances in Electrical Engineering, Electronics and Energy, vol. 1, no. 1, 100016 . https://doi.org/10.1016/j.prime.2021.100016

مصطلحات موضوعية: Effects of water, Exposure of electronics to underwater environments, Computer science, Vapor phase, Humidity, Reliability risks, Electronic packaging, Reliability engineering, Reliability (semiconductor), Electronics, Wettability in electronics, Moisture, Degradation (telecommunications)

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::241c1628f61c3fd0b5bbfa235c5f51e5
https://orbit.dtu.dk/en/publications/3af187f7-63ee-4e71-a529-b0ac5c6fb80b

المؤلفون: Qinim Guo, Helene Conseil-Gudla, Rajan Ambat

المصدر: Guo, Q, Conseil-Gudla, H & Ambat, R 2020, ' Parametric study of regional climates on electronics: Understanding local climate effects on corrosion failure mechanisms ', EUROCORR 2020, Brussels, Belgium, 07/09/2020-11/09/2020 .
Technical University of Denmark Orbit

مصطلحات موضوعية: SDG 13 - Climate Action

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::726412df6d3509470f596a083b79c02a
https://orbit.dtu.dk/en/publications/166ac2f2-2c2c-47ee-9a1a-f9de5dcf4be6

المؤلفون: Morten Stendahl Jellesen, Visweswara Chakravarthy Gudla, Rajan Ambat, Helene Conseil-Gudla, Shruti Borgaonkar

المصدر: Journal of Materials Science: Materials in Electronics. 28:6138-6151

مصطلحات موضوعية: 010302 applied physics, Materials science, Moisture, Scanning electron microscope, 02 engineering and technology, Epoxy, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Microstructure, 01 natural sciences, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Printed circuit board, Reflow soldering, Soldering, visual_art, 0103 physical sciences, visual_art.visual_art_medium, Electrical and Electronic Engineering, Composite material, 0210 nano-technology, Solder mask

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4ff1ff00a87ed189df2454c35b35cc86
https://doi.org/10.1007/s10854-016-6292-5