المؤلفون: Pellegrini, S., Nicholson, I., Helleboid, R., Mamdy, B., Forcolin, G., Al-Rawhani, M., Buj, C., Marchand, G., Rae, B., Golanski, D., Mugny, G., Bianchi, R. A., Rideau, D.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Rideau, D., Uhring, W., Bianchi, R. A., Helleboid, R., Mugny, G., Grebot, J., Manouvrier, J.R., Neri, R., Brun, F., Lakeh, M. Dolatpoor, Rink, S., Kammerer, J-B., Lallement, C., Lacombe, E., Golanski, D., Rae, B., Bah, T. M., Twaddle, F., Quenette, V., Marchand, G., Buj, C., Fillon, R., Henrion, Y., Nicholson, I., Agnew, M., Basset, M., Perrier, R., Al-Rawhani, M., Mamdy, B., Pellegrin, S., Gouget, G., Maciazek, P., Juge, A., Dartigues, A., Alause, H. Wehbe

المصدر: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2023 - IEEE 53rd European. :144-147 Sep, 2023

Relation: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)

المؤلفون: Rideau, D., Oussaiti, Y., Grebot, J., Helleboid, R., Lopez, A., Mugny, G., Bourreau, E., Golanski, D., Mamdy, B., Alause, H. Wehbe, Nicholson, I., Pellegrini, S., Vlimant, C.E., Agnew, M., Cazimajou, T., Pala, M., Saint-Martin, J., Dollfus, P.

المصدر: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2021 International Conference on. :293-296 Sep, 2021

Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Helleboid, R., Rideau, D., Grebot, J., Nicholson, I., Moussy, N., Saxod, O., Basset, M., Zimmer, A., Mamdy, B., Golanski, D., Agnew, M., Pellegrini, S., Sicre, M., Buj, C., Marchand, G., Saint-Martin, J., Pala, M., Dollfus, P.

المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 10:584-592 2022

المؤلفون: Cazimajou, T., Pala, M., Saint-Martin, J., Helleboid, R., Grebot, J., Rideau, D., Dollfus, P.

المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 9:1098-1102 2021

المؤلفون: Dollfus, P., Saint-Martin, J., Cazimajou, T., Helleboid, R., Pilotto, A., Rideau, D., Bournel, A., Pala, M.

المصدر: In Solid State Electronics August 2022 194

المؤلفون: Rideau, Denis, Oussaiti, Y., Grebot, J., Helleboid, R., Lopez, A., Mugny, G., Bourreau, E., Golanski, D., Mamdy, B., Alause, H. Wehbe, Nicholson, I., Pellegrini, S., Vlimant, C.E., Agnew, M., Cazimajou, T., Pala, M., Saint-Martin, Jérôme, Dollfus, P.

المساهمون: STMicroelectronics [Crolles] (ST-CROLLES), CEA-Direction des Energies (ex-Direction de l'Energie Nucléaire) (CEA-DES (ex-DEN)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Centre de Nanosciences et de Nanotechnologies (C2N), Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS), Sept. 27-29, 2021, Virtual conference Dallas, US, saint-martin, Jérôme

المصدر: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2021)
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2021), Sept. 27-29, 2021, Virtual conference Dallas, US, Sep 2021, Dallas, United States

مصطلحات موضوعية: [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, [SPI.TRON] Engineering Sciences [physics]/Electronics, ComputingMilieux_MISCELLANEOUS, [SPI.TRON]Engineering Sciences [physics]/Electronics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::d32e5f7a9766259e3012029483f9da88
https://hal.archives-ouvertes.fr/hal-03374008

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المؤلفون: Rideau, D., Helleboid, R., Mugny, G., Bianchi, R. A., Manouvrier, J. R., Nicholson, I., Grebot, J., Lacombe, E., Lopez, A., Golanski, D., Mamdy, B., Rae, B., Pellegrini, S., Agnew, M., Uhring, W., Rink, S., Alause, H. Wehbe

المصدر: Proceedings of SPIE; 4/25/2023, Vol. 12512, p1251205-1251205, 1p