المؤلفون: Hamdan, M., Gerner, F.M., Henderson, H.T.

المصدر: Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. Semiconductor thermal measurement and management Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE. :88-96 2003

Relation: Nineteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium

المؤلفون: Hamdan, M., Cytrynowicz, D., Medis, P., Shuja, A., Gerner, F.M., Henderson, H.T., Golliher, E., Mellott, K., Moore, C.

المصدر: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on. :457-465 2002

Relation: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

المؤلفون: Yuelei Yang, Gerner, F.M., Henderson, H.T.

المصدر: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on. :1046-1051 2002

Relation: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

المؤلفون: Pilchowski, J., Holke, A., Henderson, H.T., Harms, T.M., Kazmierczak, M., Gerner, F.M.

المصدر: Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Multichip modules and high density packaging Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on. :155-159 1998

Relation: Proceedings 1998 International Conference on Multichip Modules and High Density Packaging

المؤلفون: Gamage, S.K., Okulan, N., Henderson, H.T.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 49(12):2355-2358 Dec, 2002

المؤلفون: Walsh, K.M., Henderson, H.T., De Brabander, G.N.

المصدر: Proceedings IEEE Southeastcon '92 Southeastcon '92, Proceedings., IEEE. :753-756 vol.2 1992

Relation: Proceedings IEEE Southeastcon '92

المؤلفون: Okulan, N., Henderson, H.T., Ahn, C.H.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 47(2):340-347 Feb, 2000

المؤلفون: Henderson, H.T., Asbrock, J., Kapoor, A.

المصدر: 1978 International Electron Devices Meeting IEDM Tech. Dig. Electron Devices Meeting, 1978 International. :680-683 1978

Relation: 1978 International Electron Devices Meeting

المؤلفون: Shang-Bin Ko, Henderson, H.T.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 27(1):62-65 Jan, 1980

المؤلفون: Kapoor, A.K., Henderson, H.T.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 27(7):1268-1274 Jul, 1980