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1دورية أكاديمية
المؤلفون: Yong-jun Su, Hui Tang, Ai-min Wu, Xue-ping Dai, Shuang Liu, Hong-wei Liu, Heng Kuang
المصدر: Journal of Groundwater Science and Engineering, Vol 11, Iss 2, Pp 146-157 (2023)
مصطلحات موضوعية: natural sponge bodies, low impact development, rain flood control, hierarchy analysis, Ecology, QH540-549.5, Engineering geology. Rock mechanics. Soil mechanics. Underground construction, TA703-712
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Chuanming Ma, Wu Yan, Xinjie Hu, Heng Kuang
المصدر: Geomatics, Natural Hazards & Risk, Vol 11, Iss 1, Pp 40-70 (2020)
مصطلحات موضوعية: geo-environment risk assessment, geological environmental danger, social-economic vulnerability, zhengzhou city, Environmental technology. Sanitary engineering, TD1-1066, Environmental sciences, GE1-350, Risk in industry. Risk management, HD61
وصف الملف: electronic resource
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3مؤتمر
المؤلفون: Ho, Han-Chieh, Fan, Ta-Wei, Liau, Geng-Ying, Lin, Heng-Kuang, Chiu, Pei-Chin, Chyi, Jen-Inn, Ko, Chih-Hsin, Kuan, Ta-Ming, Hsieh, Meng-Kuei, Lee, Wen-Chin, Wann, Clement H.
المصدر: 2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM) Indium Phosphide & Related Materials (IPRM), 2010 International Conference on. :1-4 May, 2010
Relation: 2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)
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4مؤتمر
المؤلفون: Liau, Geng-Ying, Lin, Heng-Kuang, Chiu, Pei-Chin, Ho, Han-Chieh, Chyi, Jen-Inn, Ko, Chih-Hsin, Kuan, Ta-Ming, Hsieh, Meng-Kuei, Lee, Wen-Chin, Wann, Clement H.
المصدر: 2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM) Indium Phosphide & Related Materials (IPRM), 2010 International Conference on. :1-4 May, 2010
Relation: 2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)
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5مؤتمر
المؤلفون: He, Wei-Zhi, Lin, Heng-Kuang, Chiu, Pei-Chin, Chyi, Jen-Inn, Ko, Chih-Hsin, Kuan, Ta-Ming, Hsieh, Meng-Kuei, Lee, Wen-Chin, Wann, Clement H.
المصدر: 2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM) Indium Phosphide & Related Materials (IPRM), 2010 International Conference on. :1-4 May, 2010
Relation: 2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)
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6مؤتمر
المؤلفون: Yu, Cheng-Ta, Shen, Chih-Chun, Ho, Han-Chieh, Chang, Hong-Yeh, Fu, Jia-Shiang, Lin, Heng-Kuang
المصدر: 2012 Asia Pacific Microwave Conference Proceedings Microwave Conference Proceedings (APMC), 2012 Asia-Pacific. :196-198 Dec, 2012
Relation: 2012 Asia Pacific Microwave Conference (APMC)
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7مؤتمر
المؤلفون: Fan, Da-Wei, Lin, Yu-Chao, Lin, Heng-Kuang, Chiu, Pei-Chin, Chen, Shu-Han, Chyi, Jen-Inn, Ko, Chih-Hsin, Kuan, Ta-Ming, Hsieh, Meng-Kuei, Lee, Wen-Chin, Wann, Clement H.
المصدر: 2009 IEEE International Conference on Indium Phosphide & Related Materials Indium Phosphide & Related Materials, 2009. IPRM '09. IEEE International Conference on. :326-329 May, 2009
Relation: 2009 IEEE International Conference on Indium Phosphide & Related Materials (IPRM)
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8مؤتمر
المؤلفون: Lin, Yu-Chao, Fan, Ta-Wei, Lin, Heng-Kuang, Chiu, Pei-Chin, Chyi, Jen-Inn, Ko, Chih-Hsin, Kuan, Ta-Ming, Hsieh, Meng-Kuei, Lee, Wen-Chin, Wann, Clement H.
المصدر: 2009 IEEE International Conference on Indium Phosphide & Related Materials Indium Phosphide & Related Materials, 2009. IPRM '09. IEEE International Conference on. :330-333 May, 2009
Relation: 2009 IEEE International Conference on Indium Phosphide & Related Materials (IPRM)
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9مؤتمر
المؤلفون: Heng-Kuang Lin, Yu-Chao Lin, Ta-Wei Fan, Pei-Chin Chiu, Shu-Han Chen, Jen-Inn Chyi, Chih-Hsin Ko, Ta-Ming Kuan, Meng-Kuei Hsieh, Wen-Chin Lee, Wann, Clement H.
المصدر: 2008 Asia-Pacific Microwave Conference Microwave Conference, 2008. APMC 2008. Asia-Pacific. :1-4 Dec, 2008
Relation: 2008 Asia Pacific Microwave Conference - (APMJC 2008)
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10دورية أكاديمية
المؤلفون: Hacker, J.B., Bergman, J., Nagy, G., Sullivan, G., Kadow, C., Heng-Kuang Lin, Gossard, A.C., Rodwell, M., Brar, B.
المصدر: IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 14(4):156-158 Apr, 2004