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1مؤتمر
المؤلفون: Doyle, R., Hentzell, H.
المصدر: Proceedings 1997 International Conference on Multichip Modules Multichip modules Multichip Modules, 1997., International Conference on. :14-18 1997
Relation: Proceedings 1997 International Conference on Multichip Modules
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2مؤتمر
المؤلفون: Gong, S., Hentzell, H., Persson, S.-T., Hesselbom, H., Lofstedt, B., Hansen, M.
المصدر: Proceedings of Eighth International Application Specific Integrated Circuits Conference ASIC ASIC Conference and Exhibit, 1995., Proceedings of the Eighth Annual IEEE International. :21-24 1995
Relation: Proceedings of Eighth International Application Specific Integrated Circuits Conference
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3مؤتمر
المؤلفون: Dell'Acqua, A., Alippi, C., Appelquist, G., Berglund, S., Bohm, C., Breveglieri, L., Brigati, S., Del Buono, L., Carlson, P., Cattaneo, P., Dadda, L., David, J., Engstrom, M., Fumagalli, G., Gatti, U., Genat, J.F., Goggi, G., Hansen, M., Hentzell, H., Hoglund, I., Inkinen, S., Kerek, A., Lebbolo, H., LeDortz, O., Lofstedt, B., Maloberti, F., Nayman, P., Persson, S.T., Piuri, V., Salice, F., Sami, M., Savoy-Navarro, A., Stefanelli, R., Sundblad, R., Svensson, C., Torelli, G., Vanuxem, J.P., Yamdagni, N., Yuan, J., Zitoun, R.
المصدر: Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI) Wafer Scale Integration, 1994. Proceedings., Sixth Annual IEEE International Conference on. :252-264 1994
Relation: Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)
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4مؤتمر
المؤلفون: Dell'Acqua, A., Alippi, C., Appelquist, G., Benetta, R., Berglund, S., Bezemat, J., Blouzon, F., Bohm, C., Breveglieri, L., Brigati, S., Carlson, P., Cattaneo, P., Dadda, L., David, J., Engstrom, M., Furnagalli, G., Gatti, U., Genat, J.F., Goggi, G., Hansen, M., Hentzell, H., Hoglund, I., Inkinen, S., Kerek, A., LeDortz, O., Lofstedt, B., Maloberti, F., Nayman, P., Persson, S.T., Piuri, V., Salice, F., Sami, M., Savoy-Navarro, A., Schwemling, P., Stefanelli, R., Sundblad, R., Svensson, C., Torelli, G., Vanuxem, J.P., Yamdagni, N., Yuan, J., Odmark, A.
المصدر: 1993 IEEE Conference Record Nuclear Science Symposium and Medical Imaging Conference Nuclear science and medical imaging Nuclear Science Symposium and Medical Imaging Conference, 1993., 1993 IEEE Conference Record.. :773-776 1993
Relation: 1993 IEEE Conference Record Nuclear Science Symposium and Medical Imaging Conference
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5مؤتمر
المؤلفون: Dell'Acqua, A., Hansen, M., Ikinen, S., Lofstedt, B., Vanuxem, J.P., Svensson, C., Yuan, J., Hentzell, H., Del Buono, L., David, J., Genat, J.F., Lebbolo, H., LeDortz, O., Nayman, P., Savoy-Navarro, A., Zitoun, R., Alippi, C., Breveglieri, L., Dadda, L., Piuri, V., Salice, F., Sami, M., Stefanelli, R., Cattaneo, P., Fumagalli, G., Goggi, G., Brigati, S., Gatti, U., Maloberti, F., Torelli, G., Carlson, P., Kerek, A., Appelquist, G., Berglund, S., Bohm, C., Engstrom, M., Yamdagni, N., Sundblad, R., Hoglund, I., Persson, S.T.
المصدر: Proceedings of 1993 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems Defect and fault tolerance in VLSI systems Defect and Fault Tolerance in VLSI Systems, 1993., The IEEE International Workshop on. :1-8 1993
Relation: Proceedings of 1993 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems
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6
المؤلفون: Berggren, Magnus, Simon, Daniel, Nilsson, D, Dyreklev, P, Norberg, P, Nordlinder, S, Ersman, PA, Gustafsson, G, Wikner, Jacob, Hederén, J, Hentzell, H
المصدر: Advanced Materials. 28(10):1911-1916
وصف الملف: electronic
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7دورية أكاديمية
المؤلفون: Dell'Acqua, A., Alexanian, H., Alippi, C., Appelquist, G., Bailly, P., Benetta, R., Berglund, S., Bezamat, J., Blouzon, F., Bohm, C., Breveglieri, L., Brigati, S., Carlson, P., Cattaneo, P., Dadda, L., David, J., Engstrom, M., Fumagalli, G., Gatti, U., Genat, J.F., Goggi, V.G., Gong, S.F., Hansen, M., Hentzell, H., Hoglund, I., Inkinen, S., Kerek, A., LeDortz, O., Lofstedt, B., Maloberti, F., Nayman, P., Odmark, A., Piuri, V., Polesello, G., Salice, F., Sami, N., Savoy-Navarro, A., Stefanelli, R., Sundblad, R., Svensson, C., Torelli, G., Vanuxem, J.P., Yamdagni, N., Yuan, J.
المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B IEEE Trans. Comp., Packag., Manufact. Technol. B Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on. 17(3):302-309 Aug, 1994
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8مؤتمر
المؤلفون: Alippi, C., Appelquist, G., Berglund, S., Bohm, C., Breveglieri, L., Brigati, S., Carlson, P., Cattaneo, P., Dadda, L., Dell'Acqua, A., Fuglesang, C., Fumagalli, G., Gatti, U., Goggi, V.G., Hansen, M., Hentzell, H., Kerek, A., Lofstedt, B., Maloberti, F., Piuri, V., Salice, F., Sami, M., Stefanelli, R., Sundblad, R., SveNSSMICon, C., Torelli, G., Vanuxem, J.P., Yamdagni, N., Yuan, J.
المصدر: IEEE Conference on Nuclear Science Symposium and Medical Imaging Nuclear Science Symposium and Medical Imaging Conference, 1992., Conference Record of the 1992 IEEE. :424-426 vol.1 1992
Relation: 1992 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC'92)
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9دورية أكاديمية
المؤلفون: Shao-Fang Gong, Strandberg, J., Thiede, H., Hentzell, H., Hesselbom, H., Karner, W.
المصدر: IEEE Transactions on Components, Hybrids, and Manufacturing Technology IEEE Trans. Comp., Hybrids, Manufact. Technol. Components, Hybrids, and Manufacturing Technology, IEEE Transactions on. 16(7):735-742 Nov, 1993
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10دورية أكاديمية
المؤلفون: Dell'Acqua, A., Hansen, M., Lofstedt, B., Vanuxem, J.P., Svensson, C., Yuan, J., Hentzell, H., Alippi, C., Breveglieri, L., Dadda, L., Piuri, V., Salice, F., Sami, M., Stefanelli, R., Cattaneo, P., Fumagalli, G., Goggi, V.G., Brigati, S., Gatti, U., Maloberti, F., Torelli, G., Carlson, P., Fuglesang, C., Kerek, A., Appelquist, G., Berglund, S., Bohm, C., Yamdagni, N., Sundblad, R.
المصدر: IEEE Transactions on Nuclear Science IEEE Trans. Nucl. Sci. Nuclear Science, IEEE Transactions on. 40(4):516-531 Aug, 1993