المؤلفون: Doyle, R., Hentzell, H.

المصدر: Proceedings 1997 International Conference on Multichip Modules Multichip modules Multichip Modules, 1997., International Conference on. :14-18 1997

Relation: Proceedings 1997 International Conference on Multichip Modules

المؤلفون: Gong, S., Hentzell, H., Persson, S.-T., Hesselbom, H., Lofstedt, B., Hansen, M.

المصدر: Proceedings of Eighth International Application Specific Integrated Circuits Conference ASIC ASIC Conference and Exhibit, 1995., Proceedings of the Eighth Annual IEEE International. :21-24 1995

Relation: Proceedings of Eighth International Application Specific Integrated Circuits Conference

المؤلفون: Dell'Acqua, A., Alippi, C., Appelquist, G., Berglund, S., Bohm, C., Breveglieri, L., Brigati, S., Del Buono, L., Carlson, P., Cattaneo, P., Dadda, L., David, J., Engstrom, M., Fumagalli, G., Gatti, U., Genat, J.F., Goggi, G., Hansen, M., Hentzell, H., Hoglund, I., Inkinen, S., Kerek, A., Lebbolo, H., LeDortz, O., Lofstedt, B., Maloberti, F., Nayman, P., Persson, S.T., Piuri, V., Salice, F., Sami, M., Savoy-Navarro, A., Stefanelli, R., Sundblad, R., Svensson, C., Torelli, G., Vanuxem, J.P., Yamdagni, N., Yuan, J., Zitoun, R.

المصدر: Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI) Wafer Scale Integration, 1994. Proceedings., Sixth Annual IEEE International Conference on. :252-264 1994

Relation: Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)

المؤلفون: Dell'Acqua, A., Alippi, C., Appelquist, G., Benetta, R., Berglund, S., Bezemat, J., Blouzon, F., Bohm, C., Breveglieri, L., Brigati, S., Carlson, P., Cattaneo, P., Dadda, L., David, J., Engstrom, M., Furnagalli, G., Gatti, U., Genat, J.F., Goggi, G., Hansen, M., Hentzell, H., Hoglund, I., Inkinen, S., Kerek, A., LeDortz, O., Lofstedt, B., Maloberti, F., Nayman, P., Persson, S.T., Piuri, V., Salice, F., Sami, M., Savoy-Navarro, A., Schwemling, P., Stefanelli, R., Sundblad, R., Svensson, C., Torelli, G., Vanuxem, J.P., Yamdagni, N., Yuan, J., Odmark, A.

المصدر: 1993 IEEE Conference Record Nuclear Science Symposium and Medical Imaging Conference Nuclear science and medical imaging Nuclear Science Symposium and Medical Imaging Conference, 1993., 1993 IEEE Conference Record.. :773-776 1993

Relation: 1993 IEEE Conference Record Nuclear Science Symposium and Medical Imaging Conference

المؤلفون: Dell'Acqua, A., Hansen, M., Ikinen, S., Lofstedt, B., Vanuxem, J.P., Svensson, C., Yuan, J., Hentzell, H., Del Buono, L., David, J., Genat, J.F., Lebbolo, H., LeDortz, O., Nayman, P., Savoy-Navarro, A., Zitoun, R., Alippi, C., Breveglieri, L., Dadda, L., Piuri, V., Salice, F., Sami, M., Stefanelli, R., Cattaneo, P., Fumagalli, G., Goggi, G., Brigati, S., Gatti, U., Maloberti, F., Torelli, G., Carlson, P., Kerek, A., Appelquist, G., Berglund, S., Bohm, C., Engstrom, M., Yamdagni, N., Sundblad, R., Hoglund, I., Persson, S.T.

المصدر: Proceedings of 1993 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems Defect and fault tolerance in VLSI systems Defect and Fault Tolerance in VLSI Systems, 1993., The IEEE International Workshop on. :1-8 1993

Relation: Proceedings of 1993 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems

المؤلفون: Berggren, Magnus, Simon, Daniel, Nilsson, D, Dyreklev, P, Norberg, P, Nordlinder, S, Ersman, PA, Gustafsson, G, Wikner, Jacob, Hederén, J, Hentzell, H

المصدر: Advanced Materials. 28(10):1911-1916

وصف الملف: electronic

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-125994
https://liu.diva-portal.org/smash/get/diva2:911080/FULLTEXT01.pdf

المؤلفون: Dell'Acqua, A., Alexanian, H., Alippi, C., Appelquist, G., Bailly, P., Benetta, R., Berglund, S., Bezamat, J., Blouzon, F., Bohm, C., Breveglieri, L., Brigati, S., Carlson, P., Cattaneo, P., Dadda, L., David, J., Engstrom, M., Fumagalli, G., Gatti, U., Genat, J.F., Goggi, V.G., Gong, S.F., Hansen, M., Hentzell, H., Hoglund, I., Inkinen, S., Kerek, A., LeDortz, O., Lofstedt, B., Maloberti, F., Nayman, P., Odmark, A., Piuri, V., Polesello, G., Salice, F., Sami, N., Savoy-Navarro, A., Stefanelli, R., Sundblad, R., Svensson, C., Torelli, G., Vanuxem, J.P., Yamdagni, N., Yuan, J.

المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B IEEE Trans. Comp., Packag., Manufact. Technol. B Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on. 17(3):302-309 Aug, 1994

المؤلفون: Alippi, C., Appelquist, G., Berglund, S., Bohm, C., Breveglieri, L., Brigati, S., Carlson, P., Cattaneo, P., Dadda, L., Dell'Acqua, A., Fuglesang, C., Fumagalli, G., Gatti, U., Goggi, V.G., Hansen, M., Hentzell, H., Kerek, A., Lofstedt, B., Maloberti, F., Piuri, V., Salice, F., Sami, M., Stefanelli, R., Sundblad, R., SveNSSMICon, C., Torelli, G., Vanuxem, J.P., Yamdagni, N., Yuan, J.

المصدر: IEEE Conference on Nuclear Science Symposium and Medical Imaging Nuclear Science Symposium and Medical Imaging Conference, 1992., Conference Record of the 1992 IEEE. :424-426 vol.1 1992

Relation: 1992 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC'92)

المؤلفون: Shao-Fang Gong, Strandberg, J., Thiede, H., Hentzell, H., Hesselbom, H., Karner, W.

المصدر: IEEE Transactions on Components, Hybrids, and Manufacturing Technology IEEE Trans. Comp., Hybrids, Manufact. Technol. Components, Hybrids, and Manufacturing Technology, IEEE Transactions on. 16(7):735-742 Nov, 1993

المؤلفون: Dell'Acqua, A., Hansen, M., Lofstedt, B., Vanuxem, J.P., Svensson, C., Yuan, J., Hentzell, H., Alippi, C., Breveglieri, L., Dadda, L., Piuri, V., Salice, F., Sami, M., Stefanelli, R., Cattaneo, P., Fumagalli, G., Goggi, V.G., Brigati, S., Gatti, U., Maloberti, F., Torelli, G., Carlson, P., Fuglesang, C., Kerek, A., Appelquist, G., Berglund, S., Bohm, C., Yamdagni, N., Sundblad, R.

المصدر: IEEE Transactions on Nuclear Science IEEE Trans. Nucl. Sci. Nuclear Science, IEEE Transactions on. 40(4):516-531 Aug, 1993