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1دورية أكاديمية
المؤلفون: Herman, K., Herfurth, N., Henkes, T., Andreev, S., Scholz, R., Muller, M., Krattenmacher, M., Pretl, H., Grabinski, W.
المصدر: IEEE Solid-State Circuits Magazine IEEE Solid-State Circuits Mag. Solid-State Circuits Magazine, IEEE. 16(2):30-38 Jan, 2024
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2مؤتمر
المؤلفون: Boit, C., Jatzkowski, J., Altmann, F., DiBattista, M., Silverman, S., Zwicker, G., Herfurth, N., Amini, E., Seifert, J.-P.
المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-6 Jul, 2022
Relation: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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3مؤتمر
المؤلفون: Beyreuther, A., Herfurth, N., Amini, E., Nakamura, T., Motamedi, B., Boit, C.
المصدر: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2020 IEEE International Symposium on the. :1-5 Jul, 2020
Relation: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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4مؤتمر
المؤلفون: Amini, E., Kiyan, T., Herfurth, N., Beyreuther, A., Boit, C., Seifert, J.-P.
المصدر: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2020 IEEE International Symposium on the. :1-5 Jul, 2020
Relation: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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5دورية أكاديمية
المؤلفون: Anand, K., Steglich, P., Kreissl, J., Chavarin, C.A., Spirito, D., Franck, M., Lecci, G., Costina, I., Herfurth, N., Katzer, J., Mai, C., Becker, A., Reithmaier, J.P., Zimmermann, L., Mai, A.
المصدر: In Thin Solid Films 30 June 2024 799
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6مؤتمر
المؤلفون: Herfurth, N., Amini, E., Beyreuther, A., Nakamura, T., Keil, S., Boit, C.
المصدر: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2019 IEEE 26th International Symposium on. :1-5 Jul, 2019
Relation: 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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7مؤتمر
المؤلفون: Beyreuther, A., Herfurth, N., Amini, E., Nakamura, T., Fischer, G. G., Keil, S., Boit, C.
المصدر: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2019 IEEE 26th International Symposium on. :1-4 Jul, 2019
Relation: 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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8مؤتمر
المؤلفون: Herfurth, N., Beyreuther, A., Amini, E., Boit, C., Simon-Najasek, M., Hubner, S., Altmann, F., Herfurth, R., Wu, C., De Wolf, I., Croes, K.
المصدر: 2019 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2019 IEEE International. :1-9 Mar, 2019
Relation: 2019 IEEE International Reliability Physics Symposium (IRPS)
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9مؤتمر
المؤلفون: Herfurth, N., Wu, C., Nakamura, T., Wolf, I.De, Croes, K., Boit, C.
المصدر: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-5 Jul, 2018
Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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10دورية أكاديمية
المؤلفون: Beyreuther, A., Herfurth, N., Nakamura, T., Fischer, G.G., Keil, S., Boit, C.
المصدر: In Microelectronics Reliability March 2020 106
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