المؤلفون: Luo, Z., Rovedo, N., Ong, S., Phoong, B., Eller, M., Utomo, H., Ryou, C., Wang, H., Stierstorfer, R., Clevenger, L., Kim, S., Toomey, J., Sciacca, D., Li, J., Wille, W., Zhao, L., Teo, L., Dyer, T., Fang, S., Yan, J., Kwon, O., Park, D., Holt, J., Han, J., Chan, V., Yuan, J., Kebede, T., Lee, H., Lee, S., Vayshenker, A., Yang, Z., Tian, C., Ng, H., Shang, H., Hierlemann, M., Ku, J., Sudijono, J., Ieong, M.

المصدر: 2007 IEEE Symposium on VLSI Technology VLSI Technology, 2007 IEEE Symposium on. :16-17 Jun, 2007

Relation: 2007 IEEE Symposium on VLSI Technology

المؤلفون: Ieong, M., Sudijono, J., Ku, J.H., Shum, D., Hierlemann, M., Amos, R., Chiulli, G., Lindsay, R., Kim, S.D., Loesing, R., Burns, L., Turansky, A., Madan, A., St Lawrence, B., Davis, R., Murphy, R., Li, J., Kim, J.J., Zhuang, H., Mishra, S., Schepis, D., Gutmann, A., Kempisty, J., Adam, T.N., Holt, J., Ng, H., Fang, S., Chong, Y.F., Stierstorfer, R., Krishnasamy, R., Luo, Z., Rovedo, N., Teo, L.W., Utomo, H., Han, J.P.

المصدر: 2006 International Electron Devices Meeting Electron Devices Meeting, 2006. IEDM '06. International. :1-4 Dec, 2006

Relation: 2006 International Electron Devices Meeting

المؤلفون: Davis, C., Ku, J.H., Schiml, T., Sudijono, J., Yang, I., Steegen, A., Coolbough, D., Hierlemann, M., Ng, H., Amos, R., Sherony, M., Belyansky, M., Widodo, J., Tjoa, T., Edleman, N., Kwon, O., Panda, S., Yuan, J., Nguyen, P., Nivo, N., Luo, Z., Chidambarrao, D., Stierstorfer, R., Kim, J., Park, J., Ajmera, A., Baiocco, C., Ko, Y., Tan, S.S., Teh, Y.W., Dyer, T., Gao, W., Fang, S., Chen, X.

المصدر: 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers. VLSI Technology, 2006. Digest of Technical Papers. 2006 Symposium on. :60-61 2006

Relation: 2006 Symposium on VLSI Technology

المؤلفون: Yuan, J., Tan, S., Lee, Y., Kim, J., Lindsay, R., Sardesai, V., Hook, T., Amos, R., Luo, Z., Lee, W., Fang, S., Dyer, T., Rovedo, N., Stierstorfer, R., Yang, Z., Li, J., Barton, K., Ng, H., Sudijono, J., Ku, J., Hierlemann, M., Schiml, T.

المصدر: 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers. VLSI Technology, 2006. Digest of Technical Papers. 2006 Symposium on. :100-101 2006

Relation: 2006 Symposium on VLSI Technology

المؤلفون: Hierlemann, M., Kuech, T.F.

المصدر: Sixth International Conference Metalorganic Vapor Phase Epitaxy Metalorganic Vapor Phase Epitaxy, 1992. Sixth International Conference. :112-113 1992

Relation: Sixth International Conference Metalorganic Vapor Phase Epitaxy

المؤلفون: Kenda, A^Aff3, Cerva, H^Aff3, Pongratz, P^Aff5, Hierlemann, M^Aff6, Liebmann, R^Aff6

المساهمون: Cullis, A. G., editor^Aff1, Hutchison, J. L., editor^Aff2

المصدر: Microscopy of Semiconducting Materials : Proceedings of the 14th Conference, April 11–14, 2005, Oxford, UK. 107:437-440

المؤلفون: Jensen, K. F.^Aff2, Simka, H.^Aff2, Mihopoulos, T. G.^Aff2, Futerko, P.^Aff2, Hierlemann, M.^Aff2

المساهمون: Roozeboom, Fred, editor^Aff1

المصدر: Advances in Rapid Thermal and Integrated Processing. 318:305-331

المؤلفون: Cerva, H. ^*, Engelhardt, M., Hierlemann, M., Pölzl, M., Thenikl, T.

المصدر: In Physica B: Physics of Condensed Matter 2001 308:13-17

المؤلفون: Hierlemann, M. ^*, Werner, C.

المصدر: In Materials Science in Semiconductor Processing 1 March 2000 3(1-2):31-39

المؤلفون: Cullis, A. G., Hutchison, J. L., Kenda, A., Cerva, H., Pongratz, P., Hierlemann, M., Liebmann, R.

المصدر: Microscopy of Semiconducting Materials; 2005, p437-440, 4p