المؤلفون: Vandooren, A., Witters, L., Franco, J., Mallik, A., Parvais, B., Wu, Z., Li, W., Rosseel, E., Hikkavyy, A., Peng, L., Rassoul, N., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Waldron, N., Boemmels, J., De Heyn, V., Mocuta, D., Ryckaert, J., Collaert, N.

المصدر: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018 IEEE. :1-4 Oct, 2018

Relation: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

المؤلفون: E. Vecchio, T. Zheng, W. Li, Arindam Mallik, Liesbeth Witters, A. Hikkavyy, Nancy Heylen, Nadine Collaert, Fumihiro Inoue, Dan Mocuta, Z. Wu, Bertrand Parvais, Erik Rosseel, Julien Ryckaert, Niamh Waldron, J. Franco, Nouredine Rassoul, Lieve Teugels, Katia Devriendt, G. Jamieson, Juergen Boemmels, Anne Vandooren, G. Verbinnen, V. De Heyn, Lan Peng

المصدر: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

مصطلحات موضوعية: 010302 applied physics, Computer science, Transistor, Stacking, Silicon on insulator, 01 natural sciences, Reliability engineering, law.invention, Low complexity, CMOS, law, Logic gate, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, Electronic circuit

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6ece2fe9cc993dbb1c9693a4f91d037f
https://doi.org/10.1109/s3s.2018.8640203