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1دورية أكاديمية
المؤلفون: Yu, A., Lau, J. H., Ho, S. W., Kumar, A., Hnin, W. Y., Lee, W. S., Jong, M. C., Sekhar, V. N., Kripesh, V., Pinjala, D., Chen, S., Chan, C.-F., Chao, C.-C., Chiu, C.-H., Huang, C.-M., Chen, C.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(9):1336-1344 Sep, 2011
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2دورية أكاديمية
المؤلفون: Lim, S. P.-S., Rao, V. S., Hnin, W. Y., Ching, W. L., Kripesh, V., Lee, C., Lau, J., Milla, J., Fenner, A.
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 33(4):747-753 Dec, 2010
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3دورية أكاديمية
المؤلفون: Rajoo, R., Lim, S. S., Wong, E. H., Hnin, W. Y., Seah, S. K. W., Tay, A. A. O., Iyer, M., Tummala, R. R.
المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(2):377-385 May, 2008
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4دورية أكاديمية
المؤلفون: Yoon, S. W., Thew, S. M. L., Lim, S. Y. L., Hnin, W. Y., Chai, T. C., Viswanath, A. G. K., Kripesh, V.
المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(1):58-65 Feb, 2008
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